The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE. The 2014 ECTC will be held at the Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, Florida, USA.
Abstract Submission for ECTC 2014 is now closed. Authors will be notified of acceptance by December 14, 2013.
The IEEE ITHERM 2014, the Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, will be held on the same dates and at the same location of ECTC 2014. Dual-registration for ECTC and ITHERM will be offered at a substantial discount.