Technical Program

The Technical Program for the 63rd ECTC features over 300 technical papers covering all aspects of electronic packaging and interconnect technology.

The postings below are subject to change.

ECTC 2013 Final Program in PDF

Advanced Packaging
Session 1: 3D Assembly and Reliability
 Session 7: Interposers
 Session 13: 3D Processing and Technology
 Session 21: Advanced Substrate and Flip Chip Packaging
 Session 27: Wafer Level and Embedded Packaging
 Session 33: MEMS and Sensor Packaging
 Electronic Components & RF
Session 26: High Speed Interconnects & Power Distribution in 3D Integration
 Session 36: System Components for RF and Millimeter Wave
 Emerging Technologies
Session 5: New Directions in Packaging
 Session 11: Biomedical Electronics
 Interconnections
Session 3: Novel Interconnections
 Session 9: Advanced Flip Chip Technologies
 Session 14: 3D TSV Interconnects Reliability
 Session 19: Interposer Characterization
 Session 25: 3D Microbump Structures and Silicon to Silicon Bonding
 Session 31: TSV Innovation and Implementation
 Assembly & Manufacturing Technology
Session 10: Advancements in Manufacturing Technology
 Session 15: Enabling Technologies for Flip Chip Assembly
 Session 20: Challenges in 3D Integration
 Session 34: New Developments in Wirebond Technology
 Materials & Processing
Session 2: 3D Materials and Processing
 Session 17: Adhesives and Underfill Materials
 Session 23: Novel Technologies
 Session 29: Substrates
 Session 35: Solder and Bonding
 Modeling & Simulation
Session 18: Thermal and Mechanical Modeling & Simulation
 Session 24: Power and Signal Integrity
 Session 30: Electrical Modeling and Measurements
 Session 32: Thermal and Mechanical Modeling: LED and 3D Structures
 Optoelectronics
Session 6: Optical Interconnects
 Session 12: High Brightness LEDs and Materials
 Applied Reliability
Session 4: Reliability Test Methods
 Session 8: 3D Reliability and Packaging Challenges
 Session 16: Interconnect Reliability
 Session 22: Solder and Material Characterization
 Session 28: Drop and Dynamic Mechanical Reliability
 Interactive Presentations
Session 37: Interactive Presentations
 Session 38: Interactive Presentations
 Session 39: Interactive Presentations
 Session 40: Interactive Presentations
 Session 41: Student Interactive Presentations