Technical Program
This is the preliminary technical program of the 74th ECTC.
Special Sessions
Description
Session 1: Advances in Fan-Out, Wafer-Level, and Panel-Level Packaging Technologies Enabling New Applications
Session 7: Heterogeneous Integration: Systems Design, Signal & Power Delivery, and Process Optimization
Session 13: Next-Generation Substrate Manufacturing Technologies
Session 19: 3D Integration Copper-Copper Hybrid Bonding
Session 25: High-Performance Computing, Design Challenges, and Solutions
Session 31: Advances in Flip Chip and Chip Scale Packages
Applied Reliability
Session 4: Reliability of Advanced Substrates and Interconnects
Session 16: Reliability of High-Density and High-Power Packages
Session 29: Reliability in Harsh Environments Including Automotive
Session 35: Reliability and Current Stressing of Solder Interconnections
Assembly & Manufacturing Technology
Session 10: Novel 3D Integration and Hybrid Bonding Solutions
Session 23: Novel Bonding Technology for Advanced Assembly Substrates and Integration
Session 27: Advanced Die Bond and Board Level Reliability
RF, High-Speed Components & Systems
Session 18: Radio Frequency Antenna-in-Package and Component Design
Session 22: Signal & Power Integrity for Advanced Packages and Systems
Session 26: Chiplet Interconnect Design and Validation
Emerging Technologies
Session 5: Digital Health Care: Wearable Sensors, and Flexible Electronics
Session 11: Next-Generation Artificial Intelligence, Quantum Computing, and Secure Packaging
Session 17: Advanced Additive Manufacturing for Printed Electronics and Integrated Systems
Interconnections
Session 2: Advanced Die-to-Wafer Hybrid Bonding for Heterogeneous Integration
Session 8: Sub-Micron Scaling in Wafer-to-Wafer Hybrid Bonding
Session 14: Breakthrough Ultra-Fine Pitch Redistribution Layer and Solder Bumping Technologies
Session 20: Novel High-Density 3D & Thru-Via Structures and Processes
Session 26: Chiplet Interconnect Design and Validation
Session 32: Advancement in Copper Hybrid Bonding Technologies Common to Multiple Applications
Materials & Processing
Session 9: Advanced Processes for Chip Stacking
Session 15: Novel Materials and Process for Hybrid Bonding
Session 21: Innovations in Polymer Packaging Materials
Session 27: Advanced Die Bond and Board Level Reliability
Session 33: Fine-Pitch Materials and Processes
Thermal/Mechanical Simulation & Characterization
Session 6: Thermal-Mechanical Reliability Simulations
Session 12: Artificial Intelligence and Advanced Modeling Approaches
Session 24: Advances on Flex and Redistribution Layer Technologies and Warpage
Session 30: Process and Hybrid Bonding Modeling and Characterization
Session 36: Thermal Management and Cooling Solutions
Photonics
Session 3: Co-Packaged Optics
Session 28: Optical Interconnections
Session 34: Photonics Integration, Materials, and Processes
Interactive Presentations
Session 37: Interactive Presentations 1
Session 38: Interactive Presentations 2
Session 39: Interactive Presentations 3
Session 40: Interactive Presentations 4
Session 41: Student Interactive Presentations
