Technical Program

The following is the preliminary technical program for the 68th ECTC. This program may undergo many changes, in the weeks and months to come, before evolving into the Final Program of the conference.

Advanced Packaging
Session 2: Advances in Wafer and Panel Level Fan-Out Packaging
Session 3: 3D Design, Assembly and Additive Manufacturing
Session 8: Fan-Out Packaging-Applications and Architectures
Session 14: Advanced Substrates and Flip Chip Applications
Session 20: MEMS, Sensor, IoT and Flex
Session 26: Wafer Level Packaging Fan-In and Fan-Out Key Developments
Session 27: Automotive and Power Electronics
Session 32: Heterogeneous Integration
High-Speed, Wireless & Components
Session 5: Antenna-in-Package for RF and mm-Wave Systems
Session 23: RF and THz Module Components
Session 28: High-Speed and High-Bandwidth Packaging
Session 36: Power Delivery Solutions for Components and Systems
Emerging Technologies
Session 3: 3D Design, Assembly and Additive Manufacturing
Session 11: Emerging Packaging Technologies for 5G and Advanced Computing
Session 17: Technology Advances in Nano, Biochemical, Thermal and Flexible Applications
Session 7: Low Temperature Metallic Interconnection Technologies
Session 13: Fan-Out and Interposer Interconnections
Session 19: Interconnect Reliability
Session 25: Fabrication and Characterization of TSV
Session 31: Advanced Wirebond and Interconnect Technologies
Assembly & Manufacturing Technology
Session 9: Flip Chip Manufacturing Challenges
Session 15: Warpage Control in Assembly Processes
Session 26: Wafer Level Packaging Fan-In and Fan-Out Key Developments
Materials & Processing
Session 1: Flexible Electronics, Substrate for High Frequency Applications
Session 12: Sintering Pastes, Transient Liquid Phase and Direct Bonding
Session 21: Materials and Process Trends for Fan-Out Wafer Level Packaging
Session 30: Emerging Materials and Technologies
Session 33: Next Generation Materials and Processes for Through Vias and 3D Interconnects
Thermal/Mechanical Simulation & Characterization
Session 6: Warpage and Moisture Characterization
Session 22: Thermal Mechanical Modeling and Characterization
Session 29: Modeling of Power Electronics
Session 35: Multiphysics and Solder Joint Reliability
Session 18: Silicon Photonics
Session 24: Optical Module Integration
Applied Reliability
Session 4: Automotive and Harsh Environment Reliability
Session 10: Innovative Design, Modeling and Predictions for Reliability
Session 16: Advances in Interconnect Reliability and Techniques
Session 19: Interconnect Reliability
Session 34: Fan-Out Wafer Level Package Reliability
Interactive Presentations
Session 37: Interactive Presentations 1
Session 38: Interactive Presentations 2
Session 39: Interactive Presentations 3
Session 40: Interactive Presentations 4
Session 41: Student Interactive Presentations