64th ECTC Highlights

Best Papers

Best Session Paper
   "Exploration of Aging Induced Evolution of Solder Joints Using Nanoindentation and Microdiffraction" by Mohammad Hasnine, Jeffrey C. Suhling, Barton C. Prorok, Michael J. Bozack, and Pradeep Lall, Auburn University

Best Interactive Presentation Paper
   "Study of Microwave Circuits Based on Metal-Insulator-Metal (MIM) Diodes on Flex Substrates" by Amanpreet Kaur, Xianbo Yang, and Premjeet Chahal, Michigan State University

Outstanding Session Paper
   "Three-Dimensional High-Density Channel Integration of Polymer Optical Waveguide Using the Mosquito Method" by Takaaki Ishigure, Daisuke Suganuma, and Kazutomo Soma, Keio University

Outstanding Interactive Presentation Paper
   "CO2-Laser Drilling of TGVs for Glass Interposer Applications" by Lars Brusberg and Henning Schröder, Fraunhofer IZM; Marco Queisser, Marcel Neitz, and Klaus-Dieter Lang, Technical University Berlin

Intel Best Student Paper
  “A Novel Fine Pitch TSV Interconnection Method Using NCF with Zn Nano-Particles” by Ji-Won Shin, Yong-Won Choi, Young Soon Kim, Un Byung Kang, Sun Kyung Seo, and Kyung-Wook Paik, Korea Advanced Institute of Science and Technology (KAIST)

Event Presentations

1) 2014 ECTC Special Session:  Flexible Electronics – Packaging Technology and Application Trends (Chaired by Karlheinz Bock)
   Vivek Subramanian, University of California-Berkeley
   Jan Vardaman, TechSearch International
   Christoph Kutter, Fraunhofer EMFT
   Mitsuru Hiroshima, Panasonic
   Nancy Stoffel, GE Global Research

2) 2014 Electronic Components & RF Special Session: Wireless Power Transfer Systems (Chaired by Manos Tentzeris and Craig Gaw)
   Michael de Rooij, EPC
   Lilly Huang, Intel Corporation
   Yogesh Ramadass, Texas Instruments
   Francesco Carobolante, Qualcomm Technologies, Inc.
   Robert Andosca, Microgen Systems

3) 2014 ECTC Panel Session: Emerging Technologies and Market Trends of Silicon Photonics (Chaired by Ricky Lee and Jie Xue)
   Michael Watts, MIT
   Stéphane Bernabe, CEA-Leti
   John Cunningham, Oracle
   Jean Trewhella, IBM Corporation
   Peter De Dobbelaere, Luxtera
   Madeleine Glick, APIC Corporation

4) 2014 ECTC Plenary Session: Packaging Influence on System Integration and Performance (Chaired by Nancy Stoffel)
   Jon Casey, IBM Corporation
   Stephane Lessard, Ericsson
   Raj Master, Microsoft
   Li Li, Cisco Systems, Inc.
   Nozad Karim, Amkor

5) 2014 CPMT Seminar: Latest Advances in Organic Interposers (Chaired by Kishio Yokouchi and Venky Sundaram)
   Yasumitsu Orii, IBM Japan, Ltd.
   Suresh Ramalingam, Xilinx Inc.
   Tadashi Kodaira, Shinko Electric Industries Co. Ltd.
   Mitsuya Ishida, Kyocera SLC Technologies Corp.

6) 2014 ECTC Luncheon Keynote
   Keynote presentation by Peter L. Bocko – Corning, Inc.

7) Corning, Inc. Glass Learning Studio
   The Science Behind Glass - Ron Stewart
   Dispelling Some Myths About Glass - Ron Stewart
   Life Changing Glass Innovations - Gary Trott
   For more information, please see:

Media Coverage

1) Solid-State Technology
  Insights From Leading Edge, IFTLE 207 IEEE ECTC part 2: Advances in Fan-out Packaging, Dr. Phil Garrou, Contributing Editor. 

2) Solid-State Technology
  IEEE Packaging Awards handed out at 2014 ECTC, Dr. Phil Garrou, Contributing Editor

3) Google Translated Articles by Hirofumi Nakajima in Nikkei Technology Online
  "Qualcomm presents: Challenges and Opportunities of Chip Package Interaction with Fine Pitch Cu Pillar" Hirofumi Nakajima, Asia & Pacific Rim IEEE CPMT Society
  "Revolutionizing 2.5D technology: ultra-high density organic interposer" Hirofumi Nakajima, Asia and Pacific rim IEEE CPMT Society
  "Active Die Embedded Small Form Factor RF Packages" Hirofumi Nakajima, Asia and Pacific rim IEEE CPMT Society
  "IBM announced results that give a boost to the popularization of 3D-TSV" Nakajima Hirofumi, Program Director, Asia and Pacific Rim, IEEE CPMT Society

4) Yahoo Finance
  "Kingyoup Unveils High Throughput Semiconductor Wafer Bonding & Debonding Tool at ECTC 2014"

5) 3D InCites
  "Are Design Tools and Thermal Solutions the Missing Links to 2.5D and 3D IC Production?" by Francoise von Trapp
  "Fine Tuning Processes for TSV Reveal", by Francoise von Trapp
  "A Preview of 2.5D and 3D Activities"
  "Bridging the Gap to 2.5D and 3D"
  "Glass Interposers Take the Stage at ECTC 2014"

6) Reflections from the 64th ECTC – CPMT Society Newsletter Article by Sam Karikalan