Technical Program

Wednesday, May 30, 2018

Session 12: Sintering Pastes, Transient Liquid Phase and Direct Bonding
1:30 PM - 5:10 PM
Committee: Materials & Processing
Room: Nautilus 5

Session Co-Chairs:

Dwayne Shirley
Mikel Miller
EMD Perfomance Materials
T +1-951-514-4574


1. 1:30 PM - Pressure less sintering of large dies using infrared radiation and optimized silver sinter paste
Wolfgang Schmitt - Heraeus Deutschland GmbH & Co. KG
Ly May Chew - Heraeus Deutschland GmbH & Co. KG
Robert Miller - Hochschule Aschaffenburg, University of Applied Sciences

2. 1:55 PM - Direct bonding silver to aluminum using eutectic reaction in air
Shao-Wei Fu - University of California, Irvine
Chin C. Lee - University of California, Irvine

3. 2:20 PM - Effects of the Interlayer Thickness and Alloying on the Reliability of Transient Liquid Phase (TLP) Bonding
Junghyun Cho - Binghamton University (SUNY)
Fei Dong - Binghamton University (SUNY)
Liang Yin - GE Global Research
David Shaddock - GE Global Research

4. 3:30 PM - Nano-Cu Sintering Paste for High Power Devices Die Attach Applications
Jinjin Zhao - Indium Corporation
Min Yao - Indium Corporation

5. 3:55 PM - Transient Liquid Phase Sintering Using Copper-Solder-Resin Composites for High-temperature Power Modules
Hiroaki Tatsumi - Mitsubishi Electric Corporation
Adrian Lis - Osaka University
Yoshihiro Kashiba - Osaka University
Akio Hirose - Osaka University

6. 4:20 PM - Detection of liquefaction by DSC for Cu-Sn TLP bonding
Sylvain Lemettre - C2N
Pierre Alphonse - CIRIMAT
Nathalie Isac - C2N
Sana Hammami - C2N
Seonho Seok - C2N
Johan Moulin - C2N
Alain Bosseboeuf - C2N

7. 4:45 PM - Solvent-Free Sintering Pastes for High-Temperature Packaging
Matthew Wrosch - EMD Performance Materials
Catherine Shearer - EMD Performance Materials
Carl Deppisch - EMD Performance Materials