Technical Program

Thursday, May 31, 2018

Session 18: Silicon Photonics
8:00 AM - 11:40 AM
Committee: Optoelectronics
Room: Nautilus 5

Session Co-Chairs:

Takaaki Ishigure
Keio University
T +81-45-566-1593
ishigure@appi.keio.ac.jp
Soon Jang
ficonTEC USA
T +1-949-300-7715
soon.jang@ficontec.com

Papers:

1. 8:00 AM - Backside Optical I/O Module for Si Photonics Integrated with Electrical ICs Using Fan-Out Wafer Level Packaging Technology
Hiroshi Uemura - Photonics Electronics Technology Research Association
Kaori Warabi - Photonics Electronics Technology Research Association
Kazuya Ohira - Photonics Electronics Technology Research Association
Yoichiro Kurita - Photonics Electronics Technology Research Association
Haruhiko Yoshida - Photonics Electronics Technology Research Association
Hideto Furuyama - Photonics Electronics Technology Research Association
Yoshiaki Sugizaki - Toshiba Corporation
Hideki Shibata - Toshiba Corporation

2. 8:25 AM - Single Mode Optical Coupling Technology Using Movable Micro-Mirror Array and Surface Emitting DFB Laser Array for High-Density 3-D Integration
Takanori Suzuki - Oclaro Japan, Inc.
Koichiro Adachi - Oclaro Japan, Inc.
Yasunobu Matsuoka - Oclaro Japan, Inc.
Shigehisa Tanaka - Oclaro Japan, Inc.

3. 8:50 AM - 3D System-on-Packaging Using Through Silicon Via on SOI for High-Speed Optcal Interconnections with Silicon Photonics Devices for Application of 400 Gbps and Beyond
Do-Won Kim - Institute of Microelectronics, A*STAR
Li Hong Yu - Institute of Microelectronics, A*STAR
Ka Fai Chang Loh Woon Leng Chong Ser Choong Cai Hong Surya Bhattacharya

4. 10:00 AM - Broadband, Polarization-Insensitive Lensed Edge Couplers for Silicon Photonics
Bradley Snyder - IMEC
Guy Lepage - IMEC
Sadhishkumar Balakrishnan - IMEC
Peter Verheyen - IMEC
Marianna Pantouvaki - IMEC
Philippe Absil - IMEC
Joris Van Campenhout - IMEC

5. 10:25 AM - 400 Gbps 2-Dimensional Optical Receiver Assembled on Wet Etched Silicon Interposer
Chenhui Li - Eindhoven University of Technology
Ripalta Stabile - Eindhoven University of Technology
Teng Li - Eindhoven University of Technology
Oded Raz - Eindhoven University of Technology
Finn Kraemer - Mellanox Technologies Ltd

6. 10:50 AM - EOCB-Platform for Integrated Photonic Chips Direct-on-Board Assembly within Tb/s Applications
Tobias Lamprecht - Vario-Optics AG
Alex Bruderer - Varioprint AG
Joris Lambrecht - IDLab, Ghent University-IMEC
Hannes Ramon - IDLab, Ghent University-IMEC
Romeo Premerlani - Varioprint AG
Xin Yin - Ghent University-IMEC
Felix Betschon - Vario-Optics AG

7. 11:15 AM - Integrated Multi-wavelength Laser Source for Sensing
Gabriel Paré-Olivier - TeraXion
Simon Ayotte - TeraXion
François Costin - TeraXion
André Babin - TeraXion
Michel Morin - TeraXion
Benoît Filion - TeraXion
Keven Bédard - TeraXion
Ghislain Bilodeau - TeraXion
Émile Girard-Deschênes - TeraXion
P. Chrétien - TeraXion
L.-P. Perron - TeraXion