Technical Program

Thursday, May 31, 2018

Session 18: Silicon Photonics
8:00 AM - 11:40 AM
Committee: Optoelectronics
Room: Nautilus 5

Session Co-Chairs:

Takaaki Ishigure
Keio University
T +81-45-566-1593
ishigure@appi.keio.ac.jp
Soon Jang
ficonTEC USA
T +1-949-300-7715
soon.jang@ficontec.com

Papers:

1. 8:00 AM - Backside Optical I/O Module for Si Photonics Integrated with Electrical ICs using Fan-Out Wafer Level Packaging Technology
Hiroshi Uemura - Photonics Electronics Technology Research Association
Kaori Warabi - Photonics Electronics Technology Research Association
Kazuya Ohira - Photonics Electronics Technology Research Association
Yoichiro Kurita - Photonics Electronics Technology Research Association
Haruhiko Yoshida - Photonics Electronics Technology Research Association
Hideto Furuyama - Photonics Electronics Technology Research Association
Yoshiaki Sugizaki - Toshiba Corporation
Hideki Shibata - Toshiba Corporation

2. 8:25 AM - Single mode optical coupling technology using movable micro-mirror array and surface emitting DFB laser array for high-density 3-D integration
Takanori Suzuki - Oclaro Japan, Inc.
Koichiro Adachi - Oclaro Japan, Inc.
Yasunobu Matsuoka - Oclaro Japan, Inc.
Shigehisa Tanaka - Oclaro Japan, Inc.

3. 8:50 AM - 3D System-on-Packaging Using Through Silicon Via in SOI for Silicon Photonics Based High-Speed Optical Interconnection of 400 Gbps and Beyond
Do-Won Kim - Institute of Microelectroelectronics(IME)
Surya Bhattacharya - Institute of Microelectroelectronics(IME)

4. 10:00 AM - Broadband, Polarization-Insensitive Lensed Edge Couplers for Silicon Photonics
Bradley Snyder - IMEC
Guy Lepage - IMEC
Sadhishkumar Balakrishnan - IMEC
Peter Verheyen - IMEC
Marianna Pantouvaki - IMEC
Philippe Absil - IMEC
Joris Van Campenhout - IMEC

5. 10:25 AM - 400 Gbps 2-Dimensional Optical Receiver Assembled on Wet Etched Silicon Interposer
Chenhui Li - Eindhoven university of technology
Ripalta Stabile Teng Li Oded Raz

6. 10:50 AM - EOCB-Platform for Integrated Photonic Chips Direct-on-Board Assembly within Tb/s Applications
Tobias Lamprecht - vario-optics AG
Alex Bruderer - Varioprint AG
Joris Lambrecht - IDLab, Ghent University-imec
Hannes Ramon - IDLab, Ghent University-imec
Romeo Premerlani - Varioprint AG
Xin Yin - Ghent University-imec
Felix Betschon - vario-optics AG

7. 11:15 AM - Integrated multi-wavelength laser source for sensing
Gabriel Paré-Olivier - TeraXion
Simon Ayotte - TeraXion
François Costin - TeraXion
André Babin - TeraXion
Michel Morin - TeraXion
Benoît Filion - TeraXion
Keven Bédard - TeraXion
Ghislain Bilodeau - TeraXion
Émile Girard-Deschênes - TeraXion