Technical Program

Thursday, May 31, 2018

Session 19: Interconnect Reliability
1:30 PM - 5:10 PM
Committee: Interconnections
joint with Applied Reliability
Room: Harbor Island 1

Session Co-Chairs:

Chuan Seng Tan
Nanyang Technological University
T +65-67905636
tancs@alum.mit.edu
Keith Newman
AMD
T (408) 749-5566
keith.newman@amd.com

Papers:

1. 1:30 PM - Characterization of Material Damage and Microstructural Evolution Occurring in Lead Free Solders Subjected to Cyclic Loading
Md Mahmudur Chowdhury - Auburn University
Mohd Aminul Hoque - Auburn University
Nianjun Fu - Auburn University
Jeffrey Suhling - Auburn University
Sa'd Hamasha - Auburn University
Pradeep Lall - Auburn University

2. 1:55 PM - Effects of Au and Pd in pad surface finish on electro-migration of flip chip interconnection between Cu-pillar and Sn-Bi solder alloy system
Kei Murayama - Shinko Electric Industries Company, Limited
Mitsuhiro Aizawa - Shinko Electric Industries Company, Limited
Kiyoshi Oi - Shinko Electric Industries Company, Limited

3. 2:20 PM - The stress state of BGA solder joints influenced by the grain orientations of neighboring joints
Andreas Lövberg - Swerea IVF AB
Per-Erik Tegehall - Swerea IVF AB

4. 3:30 PM - Microstructure evolution of Cu/In/Cu joints
Yu Shan Chiu - National Taiwan University

5. 3:55 PM - Isothermal Fatigue of Interconnections in Flexible Hybrid Electronics Based Human Performance Monitors
Rajesh Sivasubramony - Binghamton University
Manu Yadav - Binghamton University
Nardeeka Adams - Binghamton University
Jack Lombardi - Binghamton University
Gurvinder Khinda - Binghamton University
Maan Kokash - Binghamton University
Sanoop Thekkut - Binghamton University
Darshana Weerawarne - Binghamton University
Mark Poliks - Binghamton University
Peter Borgesen - Binghamton University
Nancy Stoffel - GE Global Research

6. 4:20 PM - Board level Reliability Investigation of FO-WLP Package
Stephen Hou - Taiwan Semiconductor Manufacturing Company
K. H. Tsai - Taiwan Semiconductor Manufacturing Company
M. F. Wu - Taiwan Semiconductor Manufacturing Company
M. F. Ku - Taiwan Semiconductor Manufacturing Company
P. H. Tsao - Taiwan Semiconductor Manufacturing Company
L. H. Chu - Taiwan Semiconductor Manufacturing Company

7. 4:45 PM - Multi-axis loading impact on thermo-mechanical stress-induced damage on WLCSP and components with via-in pad plated over (VIPPO) board design configuration
Andy Hsiao - Portland State University
Mohamed Sheikh - Portland State University
Weidong Xie - Cisco Systems, Inc
Steven Perng - Cisco Systems, Inc
Edward Ibe - Zymet
Karl Loh - Zymet