Technical Program

Thursday, May 31, 2018

Session 19: Interconnect Reliability
1:30 PM - 5:10 PM
Committee: Interconnections
joint with Applied Reliability
Room: Harbor Island 1

Session Co-Chairs:

Chuan Seng Tan
Nanyang Technological University
T +65-67905636
Keith Newman
T (408) 749-5566


1. 1:30 PM - Characterization of Material Damage and Microstructural Evolution Occurring in Lead Free Solders Subjected to Cyclic Loading
Md Mahmudur Chowdhury - Auburn University
Mohd Aminul Hoque - Auburn University
Nianjun Fu - Auburn University
Jeffrey Suhling - Auburn University
Sa'd Hamasha - Auburn University
Pradeep Lall - Auburn University

2. 1:55 PM - Effects of Au and Pd in Pad Surface Finish on Electro-Migration of Flip Chip Interconnection between Cu-Pillar and Sn-Bi Solder Alloy System
Kei Murayama - Shinko Electric Industries Company, Limited
Mitsuhiro Aizawa - Shinko Electric Industries Company, Limited
Kiyoshi Oi - Shinko Electric Industries Company, Limited

3. 2:20 PM - The Stress State of BGA Solder Joints Influenced by the Grain Orientations of Neighboring Joints
Andreas Lövberg - Swerea IVF AB
Per-Erik Tegehall - Swerea IVF AB

4. 3:30 PM - Microstructure Evolution of Cu/In/Cu Joints after Solid-Liquid Interdiffusion
Yu Shan Chiu - National Taiwan University
C. Robert Kao - National Taiwan University

5. 3:55 PM - Isothermal Fatigue of Interconnections in Flexible Hybrid Electronics Based Human Performance Monitors
Rajesh Sivasubramony - Binghamton University
Nardeeka Adams - Binghamton University
M. Alhendi - Binghamton University
Gurvinder Khinda - Binghamton University
Maan Kokash - Binghamton University
J.P. Lombardi - Binghamton University
A. Raj - Binghamton University
S. Thekkut - Binghamton University
Darshana Weerawarne - Binghamton University
M. Yadav - Binghamton University
A.V. Zachariah - Binghamton University

6. 4:20 PM - Board Level Reliability Investigation of FO-WLP Package
Stephen Hou - Taiwan Semiconductor Manufacturing Company
K. H. Tsai - Taiwan Semiconductor Manufacturing Company
M. F. Wu - Taiwan Semiconductor Manufacturing Company
M. F. Ku - Taiwan Semiconductor Manufacturing Company
P. H. Tsao - Taiwan Semiconductor Manufacturing Company
L. H. Chu - Taiwan Semiconductor Manufacturing Company

7. 4:45 PM - Multi-Axis Loading Impact on Thermo-Mechanical Stress-Induced Damage on WLCSP and Components with Via-in Pad Plated Over (VIPPO) Board Design configuration
Mohamed Sheikh - Portland State University
Andy Hsiao - Portland State University
Weidong Xie - Cisco Systems, Inc
Steven Perng - Cisco Systems, Inc
Edward Ibe - Zymet
Karl Loh - Zymet
Tae-kyu Lee - Portland State University