Technical Program

Thursday, May 31, 2018

Session 22: Thermal Mechanical Modeling and Characterization
1:30 PM - 5:10 PM
Committee: Thermal/Mechanical Simulation & Characterization
Room: Nautilus 1 & 2

Session Co-Chairs:

Pradeep Lall
Auburn University
T +1-334-844-3424
Wei Wang
Qualcomm Technologies, Inc.
T +1-858-651-5933


1. 1:30 PM - Seal Ring Toughness Characterization by Numerical and Experimental Approaches
Idir Raid - STMicroelectronics
Rafael Estevez - SIMaP
S├ębastien Gallois-Garreignot - STMicroelectronics
Vincent Coutellier - STMicroelectronics

2. 1:55 PM - Reliability Life Assessment of WLCSP using Different Creep Models
K. N. Chiang - Dept. of Power Mechanical Engr., NTHU
V. Ramachandran - Dept. of Power Mechanical Engr., NTHU
K. C. Wu - Dept. of Power Mechanical Engr., NTHU
C. C. Lee - Dept. of Power Mechanical Engr., NTHU

3. 2:20 PM - On the uniqueness and sensitivity of nanoindentation testing for determining the elastic and plastic material properties of electroplating copper filled in through-silicon-via (TSV)
Liangbiao Chen - On Semiconductor
Fei Qin - Beijing University of Technology

4. 3:30 PM - Co-design for extreme large package solution with embedded fine pitch interposer (EFI) technology
Faxing Che - IME
David Ho T. C. Chai

5. 3:55 PM - Study of Polyimide in Chip Package Interaction for Flip-Chip Cu-Pillar Package
Wei Wang - Qualcomm, Inc.
Dingyou Zhang - Qualcomm, Inc.
Yangyang Sun - Qualcomm, Inc.
David Rae - Qualcomm, Inc.
Lily Zhao - Qualcomm, Inc.
Jiantao Zheng - Qualcomm, Inc.
Mark Schwarz - Qualcomm, Inc.
Milind Shah - Qualcomm, Inc.
Ahmer Syed - Qualcomm, Inc.

6. 4:20 PM - Study of the Impact of Local Stress Concentration on the Fatigue of Organic Chip Carrier
Shidong Li - IBM Corporation
Sushumna Iruvanti - IBM Corporation
Kamal Sikka - IBM Corporation
Rui Wang - IBM Corporation

7. 4:45 PM - Developments for Highly Reliable Electronics
Karsten Meier - Technical University Dresden
Mike Roellig - Fraunhofer IKTS
Karlheinz Bock - Technical University Dresden