Technical Program

Thursday, May 31, 2018

Session 22: Thermal Mechanical Modeling and Characterization
1:30 PM - 5:10 PM
Committee: Thermal/Mechanical Simulation & Characterization
Room: Nautilus 1 & 2

Session Co-Chairs:

Pradeep Lall
Auburn University
T +1-334-844-3424
Yong Liu
ON Semiconductor
T +1-207-761-3155


1. 1:30 PM - Seal Ring Toughness Characterization by Numerical and Experimental Approaches
Idir Raid - STMicroelectronics
Rafael Estevez - SIMaP
Sébastien Gallois-Garreignot - STMicroelectronics
Vincent Coutellier - STMicroelectronics

2. 1:55 PM - Reliability Life Assessment of WLCSP Using Different Creep Models
V. Ramachandran - Dept. of Power Mechanical Engr., NTHU
K. C. Wu - Dept. of Power Mechanical Engr., NTHU
C. C. Lee - Dept. of Power Mechanical Engr., NTHU
K. N. Chiang - Dept. of Power Mechanical Engr., NTHU

3. 2:20 PM - On the Uniqueness and Sensitivity of Nanoindentation Testing for Determining Elastic and Plastic Material Properties of Electroplating Copper Filled in Through-Silicon-Via (TSV)
Mahmoud El Barbary - Lamar University
Liangbiao Chen - On Semiconductor
Qin Fei - Beijing University of Technology
Yong Liu - On Semiconductor
Xuejun Fan - Beijing University of Technology

4. 3:30 PM - Co-Design for Extreme Large Package Solution with Embedded Fine Pitch Interposer (EFI) Technology
Faxing Che - Institute of Microelectronics
David Ho - Institute of Microelectronics
T. C. Chai - Institute of Microelectronics

5. 3:55 PM - Study of Polyimide in Chip Package Interaction for Flip-Chip Cu-Pillar Package
Wei Wang - Qualcomm, Inc.
Dingyou Zhang - Qualcomm, Inc.
Yangyang Sun - Qualcomm, Inc.
David Rae - Qualcomm, Inc.
Lily Zhao - Qualcomm, Inc.
Jiantao Zheng - Qualcomm, Inc.
Mark Schwarz - Qualcomm, Inc.
Milind Shah - Qualcomm, Inc.
Ahmer Syed - Qualcomm, Inc.

6. 4:20 PM - A Study of Organic Chip Carrier Fatigue Cracking
Shidong Li - IBM Corporation
Sushumna Iruvanti - IBM Corporation
Kamal Sikka - IBM Corporation
Rui Wang - IBM Corporation

7. 4:45 PM - Developments for Highly Reliable Electronics — Experiments on Combined Thermal and Vibration Loading
Karsten Meier - Technical University Dresden
Mike Roellig - Fraunhofer IKTS
Karlheinz Bock - Technical University Dresden