Technical Program

Wednesday, May 30, 2018

Session 7: Low Temperature Metallic Interconnection Technologies
1:30 PM - 5:10 PM
Committee: Interconnections
Room: Harbor Island 1

Session Co-Chairs:

David Danovitch
University of Sherbrooke
T 450-534-8000 X-1400
David.Danovitch@USherbrooke.ca
Matthew Yao
GE Energy Management
T +1-412-963-3244
matthew.yao@ge.com

Papers:

1. 1:30 PM - Laser Sintering of Dip-Based All-Copper iInterconnects
Luca Del Carro - IBM Research

2. 1:55 PM - Low Temperature Fine-pitch Wafer-level Cu-Cu Bonding Using Nanoparticles Fabricated by PVD
Zijian Wu - Institute of Microelectronics, Tsinghua University
Qian Wang - Institute of Microelectronics, Tsinghua University
Changming Song - Institute of Microelectronics, Tsinghua University
Jian Cai - Institute of Microelectronics, Tsinghua University

3. 2:20 PM - Wafer-level Cu-Cu bonding by applying Cu nanoparticles to Cu bumps with pattern printing method
Qi Liang - Huazhong University of Science and Technology
Junjie Li - Huazhong University of Science and Technology
Tielin Shi - Huazhong University of Science and Technology
Junfeng Wang - Huazhong University of Science and Technology
Tianxiang Li - Huazhong University of Science and Technology
Guanglan Liao - Huazhong University of Science and Technology
Zirong Tang - Huazhong University of Science and Technology

4. 3:30 PM - Demonstration of patternable, compliant Cu pillar with nanocopper cap interconnections for manufacturable Cu-Cu bonding in chip-to-substrate applications
Kashyap Mohan - Georgia Institute of Technology
Ninad Shahane - Georgia Institute of Technology
Ramon Sosa - Georgia Institute of Technology
Raj Pulugurtha - Georgia Institute of Technology
Antonia Antoniou - Georgia Institute of Technology
Vanessa Smet - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology

5. 3:55 PM - Low-Temperature, Pressureless Cu-to-Cu Bonding Using Microfluidic Electroless Interconnection Process
Sean Yang - National Taiwan University
H. T. Hung - National Taiwan University
H. NISHIKAWA - Joining and Welding institute Osaka University
C. Robert Kao - National Taiwan University

6. 4:20 PM - Scaling Packaging Interconnect below 20 ┬Ám with Low Temperature Hybrid Bonding
Guilian Gao - Xperi
Gill Fountain Cyprian Uzoh Bongsub Lee Laura Mirkarimi Gabe Guevara Liang Wang Chandrasekhar Mandalapu Thomas Workman

7. 4:45 PM - Mirco-silver sinter paste developed for pressure sintering on bare Cu surfaces under air or inert atmosphere
Ly May Chew - Heraeus Deutschland GmbH & Co. KG
Wolfgang Schmitt - Heraeus Deutschland GmbH & Co. KG
Jens Nachreiner - Heraeus Deutschland GmbH & Co. KG