Technical Program

Wednesday, May 30, 2018

Session 7: Low Temperature Metallic Interconnection Technologies
1:30 PM - 5:10 PM
Committee: Interconnections
Room: Harbor Island 1

Session Co-Chairs:

David Danovitch
University of Sherbrooke
T +1-450-534-8000 X-1400
David.Danovitch@USherbrooke.ca
Matthew Yao
GE Energy Management
T +1-412-963-3244
matthew.yao@ge.com

Papers:

1. 1:30 PM - Laser Sintering of Dip-Based All-Copper Interconnects
Luca Del Carro - IBM Corporation
Thomas Brunschwiler - IBM Corporation
Martin Kossatz - Pac Tech - Packaging Technologies GmbH
Lucas Schnackenberg - Pac Tech - Packaging Technologies GmbH
Matthias Fettke - Pac Tech - Packaging Technologies GmbH
Ian Clark - Intrinsiq Materials Ltd

2. 1:55 PM - Low Temperature Fine-pitch Wafer-level Cu-Cu Bonding Using Nanoparticles Fabricated by PVD
Zijian Wu - Institute of Microelectronics, Tsinghua University
Qian Wang - Institute of Microelectronics, Tsinghua University
Changming Song - Institute of Microelectronics, Tsinghua University
Jian Cai - Institute of Microelectronics, Tsinghua University

3. 2:20 PM - Transient Liquid Phase Bonding Using AgSn-Alloys for Stress Reduced Sensor Mounting
Markus Feisst - University of Freiburg, IMTEK
Jun Yu - University of Freiburg, IMTEK
Juergen Wilde - University of Freiburg, IMTEK

4. 3:30 PM - Demonstration of Patternable All-Cu Compliant Interconnections with Enhanced Manufacturability in Chip-to-Substrate Applications
Kashyap Mohan - Georgia Institute of Technology
Ninad Shahane - Georgia Institute of Technology
Ramon Sosa - Georgia Institute of Technology
Raj Pulugurtha - Georgia Institute of Technology
Antonia Antoniou - Georgia Institute of Technology
Vanessa Smet - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology
Sadia Khan - Texas Instruments Inc.

5. 3:55 PM - Development of Low-temperature, Presssureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection Process
Sean Yang - National Taiwan University
H. T. Hung - National Taiwan University
H. Nisikawa - Joining and Welding institute Osaka University
C. Robert Kao - National Taiwan University

6. 4:20 PM - Scaling Packaging Interconnect Below 20 ┬Ám with Hybrid Bonding
Guilian Gao - Xperi
Laura Mirkarimi - Xperi
Gill Fountain - Xperi
Liang Wang - Xperi
Cyprian Uzoh - Xperi
Thomas Workman - Xperi
Gabe Guevara - Xperi
Chandrasekhar Mandalapu - Xperi
Bongsub Lee - Xperi
Rajesh Katkar - Xperi

7. 4:45 PM - Mirco-Silver Sinter Paste Developed for Pressure Sintering on Bare Cu Surfaces Under Air or Inert Atmosphere
Ly May Chew - Heraeus Deutschland GmbH & Co. KG
Wolfgang Schmitt - Heraeus Deutschland GmbH & Co. KG
Christian Schwarzer - Heraeus Deutschland GmbH & Co. KG
Jens Nachreiner - Heraeus Deutschland GmbH & Co. KG