ECTC | IEEE Electronic Components and Technology Conference

65th ECTC Highlights

Best Papers

1) Best Session Paper
“Automated, Self-Aligned Assembly of 12 Fibers per Nanophotonic Chip with Standard Microelectronics Assembly Tooling” by Tymon Barwicz, Nicolas Boyer, Stephane Harel, Alexander Janta-Polczynski, Swetha Kamlapurkar, Sebastian Engelmann, Yurii A. Vlasov, and Paul Fortier – IBM Corporation; Ted W. Lichoulas and Eddie L. Kimbrell – AFL Telecommunications

2) Best Interactive Presentation Paper
“Modeling, Design and Demonstration of Low-Temperature, Low-Pressure and High-Throughput Thermocompression Bonding of Copper Interconnections without Solders” by Ninad Shahane, Scott McCann, Venky Sundaram, Pulugurtha Markondeya Raj, Vanessa Smet, and Rao Tummala – Georgia Institute of Technology; Gustavo Ramos, Arnd Killian, and Robin Taylor – Atotech GmbH

3) Outstanding Session Paper
“Noise Coupling between TSVs and Active Devices: Planar nMOSFETs vs. nFinFETs” by Xiao Sun, W. Guo, C. Roda Neve, I. De Wolf, G. Van der Plas, E. Beyne, and P. Absil – IMEC; A. Rouhu Najaf Abadi – Katholieke Universiteit Leuven; K. Ben Ali, M. Rack, and J. P. Raskin – Université Catholique de Louvain; M. Choi and V. Moroz – Synopsys, Inc.

4) Outstanding Interactive Presentation Paper
“On the Failure Mechanism in Lead-Free Flip-Chip Interconnects Comprising ENIG Finish during Electromigration” by Marek Gorywoda – Hochschule für Angewandte Wissenschaften Hof; Rainer Dohle, Andreas Wirth, Bernd Burger, and Jörg Goßler – Micro Systems Engineering GmbH

5) Intel Best Student Paper
“Size Effect on Ductile-to-Brittle Transition in Cu-Solder-Cu Micro-Joints” by Yaodong Wang, Igor M. De Rosa, and K. N. Tu – University of California, Los Angeles

Event Presentations

1) 2015 ECTC Luncheon Keynote – Smartphone-Powered Future
Matthew Grob – Qualcomm Technologies, Inc.

2) 2015 ECTC Special Session: Sustainability in Microelectronics (Chair: Ibrahim Guven – Virginia Commonwealth University)
   William Bullock – University of Illinois at Urbana-Champaign
   Karen Butner – IBM Corporation
   Corey Gough – Intel Corporation
   Michelle Lee – Qualcomm Technologies Inc.
   Michael Pierce – Texas Instruments

3) 2015 Assembly & Manufacturing and Advanced Packaging Special Session – Advancements in Bio-Medical Technology & Associated Packaging (Chairs: Shawn Shi – Medtronic, John Knickerbocker – IBM Corporation)
   Gaurav Jain – Medtronic
   Kaustubh Nagakar – General Electric
   Gabriel Mouchawar – St. Jude Medical
   Robert Schuelke – Mayo Clinic
   Navin Govind – Aventyn

4) 2015 ECTC Panel Session – Nanopackaging: Hype, Hope, or Happening (Chairs: James E. Morris – Portland State University, Jie Xue – CPMT President, Cisco Systems Inc.)
   Alexander Balandin – University of California, Riverside
   Taisuke Iwai – Fujitsu Laboratories
   Nancy Iwamoto – Honeywell
   Ravi Mahajan – Intel Corporation
   Katsuaki Suganuma – Osaka University

5) 2015 ECTC Plenary Session – The Internet of Things and the Future of Interconnected Electronics (Chair: E. Jan Vardaman – TechSearch International, Inc.)
   Jerry Tzou – TSMC
   Li Li – Cisco Systems, Inc.
   Ilyas Mohammed – Jawbone
   Subramanian Iyer – IBM Corporation, University of California, Los Angeles

6) 2015 CPMT Women’s Panel & Reception – Own Your Professional Success – What You Should Do (Chair: Beth Keser – Qualcomm Technologies, Inc.)
   Jie Xue – Cisco Systems, Inc.
   Jean Trewhella – GLOBALFOUNDRIES
   Navrina Singh – Qualcomm Labs, Inc.

7) 2015 CPMT Seminar – Liquid and Phase-Change Cooling for High-Performance Systems (Chairs: Venkatesh Sundarem – Georgia Institute of Technology, Yasumitsu Orii – IBM Research Tokyo)
   Jie Wei – Fujitsu
   Hitoshi Sakamoto – NEC Corporation
   Kousuke Suzuki – Dai Nippon Printing Co., Ltd.
   Yasuhiro Kawase – Mitsubishi Chemical Corporation