Breaking news: ECTC will be a Virtual conference in 2021
Abstract submission is now closed.
The difficult decision was made to maximize participation and allow for predictable planning for authors, attendees, exhibitors, and sponsors. We intend to build upon the outstanding success of the 2020 conference to create an event that delivers excellent and relevant technical content for the community.

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

Subscribe to our mailing list | 71st ECTC Call for Papers

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Upcoming Dates

Rejection letters | December 18, 2020
Manuscripts due | February 28, 2021

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Location

Virtual
June 1 - July 4, 2021

The 71st ECTC will be a virtual event.

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