The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

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Upcoming Dates

Abstract Submission Closes | October 11, 2021
PDC Submissions Due | October 16, 2021

Location

San Diego, California
May 31- June 3, 2022

 

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