Breaking news: ECTC will be a Virtual conference in 2021
Abstract submission open till November 1st, 2020
The difficult decision was made to maximize participation and allow for predictable planning for authors, attendees, exhibitors, and sponsors. We intend to build upon the outstanding success of the 2020 conference to create an event that delivers excellent and relevant technical content for the community; In response to this change in the format of the conference, abstracts will continue to be accepted until November 1st.

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

Subscribe to our mailing list | 71st ECTC Call for Papers

Read More >>

Upcoming Dates

Abstract submission open | August 15, 2020
Abstracts due | November 1, 2020

Read More >>

Location

Virtual
June 1 - 4, 2021

The 71st ECTC will be a virtual event.

Read More >>

Interested in receiving updates from us?
Subscribe to our mailing list by clicking on this link