The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

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Upcoming Dates

Abstract Submission Opens | August 15, 2022
Abstract Submission Deadline | October 17, 2022
Abstract Acceptance Decision | December 16, 2022


Orlando, Florida
May 30- June 2, 2023


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