Professional Development Courses
Welcome!
The 2025 ECTC Professional Development Courses Committee have selected 16 PDCs for presentation at the 2025 ECTC on May 27 at the Gaylord Texas Resort & Convention Center. These PDCs are 4-hour, Professional Development Course (PDCs) on relevant electronic packaging topics and are taught by world-class experts, enabling participants to broaden their technical knowledge base. Attendees of the PDCs will be offered Continuing Education Units (CEUs) or Professional Development Hours (PDHs). These CEUs and PDHs are recognized by employers as a formal measure of participation and attendance in “noncredit” self-study courses, tutorials, symposia, and workshops. Below you will find the list of the 2025 PDCs that are being offered. Each PDC has a clickable link that will take you to each PDC course description, course outline, who should attend, and a short author bio.
Please take a moment and review each course. Courses 1 - 8 are offered in the AM and Courses 9 - 16 are offered in the PM.
I look forward to seeing you at the ECTC PDC’s!
Kitty Pearsall, PhD., PE
ECTC PDC Chair
Contact Kitty Pearsall, the ECTC PDC Committee chair, in case of questions.
MORNING COURSES 8:00 AM – 12:00PM
- High Reliability Soldering in Semiconductor Packaging
Course Leader: Ning-Cheng Lee – ShinePure Hi-Tech 2 - Photonic Technologies for Communication, Sensing, and Displays
Course Leader: Torsten Wipiejewski, Huawei Technologies - From Wafer to Panel Level Packaging
Course Leaders: Tanja Braun and Piotr Mackowiak – Fraunhofer IZM - Eliminating Failure Mechanisms in Advanced Packages
Course Leader: Darvin Edwards – Edwards Enterprises - Introduction to and Advances in 2.3D Fan-Out Wafer Level Packaging (FO-WLP)
Course Leader: Beth Keser – Zero ASIC - Wafer-to Wafer and Die-to-Wafer Hybrid Bonding for Advanced Interconnects
Course Leader: Viorel Dragoi – EV Group - RF Design and Fabrication Processes of Advanced Packages Including Fan-Out, Chiplets, Glass and Organic Interposers
Course Leaders: Ivan Ndip and Markus Wöhrmann – Fraunhofer IZM - Design of Reliable Data Center Cooling Systems
Course Leaders: Patrick McCluskey and Damena Agonager –University of Maryland
AFTERNOON COURSES 1:15 AM – 5:15PM
- 3D Packaging Failure Mechanisms and Analytical Tools
Course Leader: Deepak Goyal – Independent Consultant - Diamond foe Heterogeneous Integration
Course Leader: Joana Mendes – Aveiro University - Advanced Packaging – Chiplet, Heterogeneous Integration, and Co-Packaged Optics
Course Leader: John Lau – Unimicron - Analysis of Fracture and Delamination in Microelectronic Packages
Course Leader: Andrew Tay - National University of Singapore - Advanced Fan-Out Developments and Applications
Course Leaders: John Hunt and Jan Vardaman – TechSearch International - Flip Chip Technologies
Course Leader: Shengmin Wen - TATA - Design-On-Simulation for Advanced Packaging: Warpage Management, Reliability and Life Prediction
Course Leaders: Kuo-Ning Chiang – National Tsing Hua University and Xuejan Fan – Lamar University - Current and Future Challenges and Solutions in AI & HPC System and Thermal Management
Course Leader: Gamal Refai-Ahmed – AMD
