Professional Development Courses

I am excited about the line-up for the Professional Development Courses (PDC) for the 69th ECTC in Las Vegas, Nevada.  There is a strong slate of industry experts that we have engaged to cover key Electronic Component and Manufacturing Technologies.  As you review the courses below please consider either an AM/PM course, or both, that fits your development needs.  As always ECTC offers 0.4 CEU’s for each course.  This is a great and interesting way to fulfill your individual state’s Professional License requirements or simply a way to stay in touch with specific areas in your field.

I look forward to seeing you in Las Vegas.

Kitty Pearsall, PhD., PE
ECTC PDC Chair

MORNING COURSES 8:00 AM – 12:00PM

  1. ACHIEVING HIGH RELIABILITY OF LEAD-FREE SOLDER JOINTS – MATERIALS CONSIDERATIONS
    Course Leader: Ning-Cheng Lee – Indium Corporation
  2. INTRODUCTION TO FAN-OUT WAFER LEVEL PACKAGING
    Course Leader: Beth Keser – Intel Corporation
  3. FUNDAMENTALS OF GLASS TECHNOLOGY AND APPLICATIONS FOR ADVANCED SEMICONDUCTOR PACKAGING
    Course Leader: Dr. Indrajit Dutta – Corning, Inc.
  4. MOORE’S LAW FOR PACKAGING TO REPLACE MOORE’S LAW FOR ICS
    Course Leader: Rao Tummala – Georgia Institute of Technology
  5. POLYMERS AND NANOCOMPOSITES FOR ELECTRONIC AND PHOTONIC PACKAGING
    Course Leaders: C. P. Wong – Georgia Institute of Technology; Daniel Lu – Henkel Corporation
  6. FUNDAMENTALS OF RF DESIGN AND FABRICATION PROCESSES OF FAN-OUT WAFER/PANEL LEVEL PACKAGES AND INTERPOSERS
    Course Leaders: Ivan Ndip and Markus Wöhrmann – Fraunhofer IZM
  7. SOLVING PACKAGE FAILURE MECHANISMS FOR IMPROVED RELIABILITY
    Course Leader: Darvin Edwards –Edwards Enterprises
  8. CHARACTERIZATION OF ADVANCED EMCs FOR FO-WLP, HETEROGENEOUS INTEGRATION, AND AUTOMOTIVE ELECTRONICS
    Course Leaders: Przemyk Gromala – Robert Bosch GmbH; Bongtan Han – University of Maryland
  9. INTEGRATED THERMAL PACKAGING AND RELIABILITY OF POWER ELECTRONICS
    Course Leader: Patrick McCluskey – University of Maryland

AFTERNOON COURSES 1:15 AM – 5:15PM

  1. FLIP CHIP TECHNOLOGIES
    Course Leaders: Eric Perfecto – Independent Consultant; Shengmin Wen – Synaptics Inc.
  2. WAFER-LEVEL CHIP-SCALE PACKAGING (WCSP) FUNDAMENTALS
    Course Leader: Patrick Thompson -- Texas Instruments, Inc.
  3. FLEXIBLE HYBRID TECHNOLOGIES – MANUFACTURING AND RELIABILITY
    Course Leader: Pradeep Lall – Auburn University
  4. FAN-OUT WAFER/PANEL LEVEL PACKAGING AND 3D IC HETEROGENEOUS INTEGRATION
    Course Leader: John Lau – ASM Pacific Technology Ltd.
  5. POLYMERS FOR WAFER LEVEL PACKAGING
    Course Leader: Jeffrey Gotro –InnoCentrix, LLC
  6. RELIABILITY MECHANICS AND MODELING FOR IC PACKAGING – THEORY, IMPLEMENTATION AND PRACTICES
    Course Leaders: Ricky Lee -- HKUST and Xuejun Fan – Lamar University
  7. ROBUST ELECTRONICS FOR AUTOMOTIVE APPLICATIONS INCLUDING AUTONOMOUS DRIVING
    Course Leaders: Matthias Petzold – Fraunhofer IZM, Mervi Paulasto-Kröckel – Aalto University, and Klaus-Juergen Wolter – TU Dresden
  8. FROM WAFER TO PANEL LEVEL PACKAGING
    Course Leaders: Tanja Braun and Michael Töpper – Fraunhofer IZM
  9. ELECTRONICS COOLING TECHNOLOGIES FOR HANDHELD DEVICES, COMPUTING, AND HIGH-POWER ELECTRONICS
    Course Leaders: William Maltz and Guy Wagner – Electronic Cooling Solutions

Contact Kitty Pearsall, the ECTC PDC Committee chair, in case of questions.