Professional Development Courses



1.  High Reliability Soldering in Semiconductor Packaging
Course Leader: Ning-Cheng Lee – ShinePure Hi-Tech

2. Photonic Technologies for Communication, Sensing, and Displays
Course Leader: Torsten Wipiejewski, Huawei Technologies

3.  From Wafer to Panel Level Packaging
Course Leaders: Tanja Braun and Piotr Mackowiak – Fraunhofer IZM

4.  Eliminating Failure Mechanisms in Advanced Packages
Course Leader: Darvin Edwards – Edwards Enterprises

5. Navigating Thermal and Reliability Challenges in Chip Components for Automotive High-Performance Compute Systems
Course Leader: Fen Chen -- Automotive Reliability/Validation Consultation Services

6. Polymers for Advanced Packaging
Course Leader: Jeffrey Gotro –InnoCentrix, LLC

7. Flip Chip Technologies
Course Leader: Shengmin Wen – SiMa Technologies, Inc.

8. Reliable Integrated Thermal Packaging for Power Electronics
Course Leader: Patrick McCluskey – University of Maryland and Damena Agonager – NEIT Laboratory, University of Maryland


9. Additive Flexible Hybrid Electronics – Manufacturing and Reliability
Course Leader: Pradeep Lall – Auburn University

10. Fundamentals of RF Design and Fabrication Processes of Fan-Out Wafer/Panel Level and Advanced RF Packages
Course Leaders: Ivan Ndip – Fraunhofer IZM/Brandenburg University of Technology and Markus Wöhrmann – Fraunhofer IZM

11. Advanced Packaging – Fan-Out, Chiplet, and Heterogeneous Integration
Course Leader: John Lau – Unimicron

12. Analysis of Fracture and Delamination in Microelectronic Packages
Course Leader: Andrew Tay - National University of Singapore

13. Advanced Packaging for MEMS and Sensors
Course Leader: Horst Theuss – Infineon Technologies AG

14. Nano Materials and Polymer Composites for Electronic Packaging
Course Leaders: C.P. Wong – Georgia Tech and Daniel Lu – Henkel Corporation

15. Design-On-Simulation for Advanced Packaging Reliability and Life Prediction
Course Leaders:  Kuo-Ning Chiang – National Tsing Hua University

16. Thermal Spreading and Contact Resistance
Course Leaders: Yuri Muzychka – Memorial University of Newfoundland and Marc Hodes – Tufts University

Contact Kitty Pearsall, the ECTC PDC Committee chair, in case of questions.