Technical Program

The following is the preliminary technical program for the 69th ECTC. This program may undergo many changes, in the weeks and months to come, before evolving into the Final Program of the conference.

Packaging Technologies
Session 1: Wafer-Level Fan-Out Process Integration
 Session 3: RDL and Additive Manufacturing
 Session 7: Advances in Flip Chip Packaging
 Session 13: Technologies Enabling 3D and Heterogeneous Integration
 Session 19: MEMS, Sensors, and IoT
 Session 25: Wafer Level Packaging and Fan-In/Fan-Out Structures & Materials
 Session 28: Embedded and Integrated Technologies
 Session 31: Automotive and Power Packaging
 High-Speed, Wireless & Components
Session 15: High-Bandwidth Packaging
 Session 21: 5G, mm-Wave, and Antenna-in-Package
 Session 26: High-Speed Signaling for High-Performance Computing and Memory
 Session 36: RF & Power Components and Modules
 Emerging Technologies
Session 3: RDL and Additive Manufacturing
 Session 6: Emerging Flexible Hybrid Electronics
 Session 27: Advanced Biosensors and Bioelectronics
 Interconnections
Session 2: Next-Generation Wirebonding and Die Attach
 Session 14: Fine-Pitch Solderless Bonding
 Session 20: Fanout and Heterogeneous Integration
 Session 23: High-Bandwidth 3D and Photonic Integration
 Session 35: New Interconnects for Package Scaling
 Assembly & Manufacturing Technology
Session 5: Bonding Manufacturing Technologies
 Session 10: Dicing and Encapsulation Technologies
 Session 28: Embedded and Integrated Technologies
 Session 32: Power and Panel Assembly
 Materials & Processing
Session 4: Advancements in Automotive and Power Devices
 Session 8: Material and Process Trends in FOWLP and PLP
 Session 16: Advanced Materials for High-Speed Electronics
 Session 22: Advanced Substrates and Interconnect Technology
 Session 34: Emerging Materials and Processing
 Thermal/Mechanical Simulation & Characterization
Session 9: Wearables and Thin-Package Reliability and Chip Package Interaction
 Session 18: Warpage and Material Performance
 Session 30: Assembly and Process Modeling
 Session 33: Fan-Out, Flip Chip, and WLCSP
 Photonics
Session 12: Advanced Photonic Devices and Packaging
 Session 23: High-Bandwidth 3D and Photonic Integration
 Applied Reliability
Session 11: Automotive and Harsh-Environment Reliability
 Session 17: Materials and Design for Reliability of Next-Generation Packages
 Session 24: Advancements in Solder Joint Characterization and Reliability Evaluation
 Session 29: Electromigration and Innovative Reliability Test Methods
 Interactive Presentations
Session 37: Interactive Presentations 1
 Session 38: Interactive Presentations 2
 Session 39: Interactive Presentations 3
 Session 40: Interactive Presentations 4
 Session 41: Student Interactive Presentations