70th ECTC Highlights

Note: We will provide links to the presentations as they become available.

Best Papers

By clicking on the links below for each of the Best 2020 ECTC Papers, you are agreeing to IEEE Copyright Policy. These papers appear with permission from IEEE and are for personal use only.  Any other use requires permission.

1) Best Session Paper
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2) Best Interactive Presentation Paper
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3) Outstanding Session Paper
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4) Outstanding Interactive Presentation Paper
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5) Intel Best Student Session Paper
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6) TI Best Student Interactive Presentations Paper
Coming Soon

Event Presentations

1)      2020 ECTC Virtual Conference Keynote: Innovative Heterogeneous Integration Technologies Initiate a New Semiconductor Era
   Douglas Yu – Taiwan Semiconductor Manufacturing Company (TSMC

Special Session: Bridge to quantum Computing
(Chairs: Nicholas Bronn – IBM Research and Pavel Roy Paladhi – IBM Systems)
Nicholas Bronn – IBM Research Yorktown Heights
Paul Franzon – North Carolina State University
Amir Jafari-Salim – SeeQC
Rabindra Das – MIT Lincoln Laboratory

Special Session: Diversity and Inclusion Drives Innovation and Productivity
(Chairs: Kitty Pearsall – Boss Precision and Cristina Amon – University of Toronto)
Adeel Bajwa – Kulicke and Soffa Industries
Allyson Hardzell – Veryst Engineering, LLC.
Amy S. Fleisher – California Polytechnic State University
Ivan Ndip – Fraunhofer IZM

Special Session: 3DIC - Past, Present and Future
(Chairs: Michael Mayer – University of Waterloo)
Douglas Yu – TSMC
Eric Beyne – IMEC
Mitsumasa Koyanagi – Tohoku University
Paul Franzon – North Carolina State University
Peter Ramm – Franhofer Research Institute for Microsystems and Solid State Technologies (EMFT)

Special Session: Future Semiconductor Packages For Artificial Intelligence Hardware
(Chairs: Yasumitsu Orii – Nagase and Pavel Roy Paladhi – Shigenori Aoki - Fujitsu)
Hiroyuki Akinaga – The National Institute of Advanced Science and Technology (AIST)
Rama Divakaruni – IBM T. J. Watson Research, Albany NY
Subramanian S. Iyer – University of California, Los Angeles, “CHIPS”
Swaminathan Madhavan – Georgia Institute of Technology
Takashi Hisada – IBM Research Tokyo

Special Session: Heterogeneous Integration Roadmap Workshop
Amr Helmy – University of Toronto
Bill Bottoms – 3MT Solutions
Ravi Mahajan – Intel
Tom Salmon – SEMI
William Chen – ASE

Media Coverage

Chip Scal Review:
2020 ECTCVirtual for the1st Time ReachedRecord Numbers

Semiconductor Engineering:
The Next Advanced Packages

Impressive turn-out for the virtual 70th ECTC

3D Incites:
On Lost Years and Gang Bonding for Multi-die Stacking

The Global Packaging Community Shows up for Virtual ECTC!

ECTC 2020 Keynote: Moore’s Law 2.0 Brought to You by HIT

Hybrid Bonding Comes of Age

SPIL Fan-out Embedded Bridge (FOEB) Technology  

TSMC Exhibits Packaging Prowess at Virtual ECTC 2020 

ECTC 2020 Online is Accessible at No Charge  

Stay Virtually Connected with Your Industry Colleagues and Favorite Topics at ECTC 2020

The news enterprise:
ECTC preparing for changes in the fall because of COVID-19