Technical Program

Session 17: Latest Trends in Fan-Out Packaging and Substrate Technology
Committee: Materials & Processing

Session Co-Chairs:

Yu-Hua Chen
Unimicron
T +886-3-5995899#2109
yh_chen@unimicron.com
Tanja Braun
Fraunhofer IZM
T +49 30 46403244
tanja.braun@izm.fraunhofer.de

Papers:

1. Fine RDL Patterning Technology for Heterogeneous Packages in Fan-Out Panel Level Packaging
Changbo Lee - Samsung Electronics Company, Ltd.
Sangyun Lee - Samsung Electronics Company, Ltd.
Yoon Young Jeon - Samsung Electronics Company, Ltd.
Hyun-Dong Lee - Samsung Electronics Company, Ltd.
Young Min Kim - Samsung Electronics Company, Ltd.
Byung-Lyul Park - Samsung Electronics Company, Ltd.

2. Reliability Performance of Advanced Organic Interposer (CoWoS®-R) Packages
Po-Yao Lin - Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Chih Yew Shu-Shen Yeh Suo-Mao Chen Chia-Hsiang Lin Chien-Shen Chen Cheng Chi Hsieh Yi-Hang Lin Yung Jean Lu Si-Guei Cheng Shin-Puu Jeng

3. Novel Insulation Materials Suitable for FOWLP and FOPLP
Shu Ikehira - Ajinomoto Co., Inc.

4. Versatile Laser Release Material Development for Chip-First and Chip-Last Fan-Out Wafer Level Packaging
Chia-Hsin Lee - Brewer Science, Inc.
Baron Huang - Brewer Science, Inc.
Jennifer See - Brewer Science, Inc.
Xiao Liu - Brewer Science, Inc.
Yu-Min Lin - Electronics and Optoelectronics Research Laboratories, ITRI
Wei-Lan Chiu - Electronics and Optoelectronics Research Laboratories, ITRI
Chao-Jung Chen - National Chiao Tung University
Ou-Hsiang Lee - National Chiao Tung University
Hsiang-En Ding - National Chiao Tung University
Ren-Shin Cheng - National Chiao Tung University
Ang-Ying Lin - National Chiao Tung University

5. Flexible Two-Layered Photo-Imageable Dielectric and Its Application to Thin Form-Factor and High-Density FPC (Flexible Printed Circuit) Using SAP (Semi-Additive Processes)
Shuhei Takashima - Taiyo Ink Mfg. Co., Ltd.
Yuto Odagiri - Taiyo Ink Mfg. Co., Ltd.
Kazuyoshi Yoneda - Taiyo Ink Mfg. Co., Ltd.
Tadahiko Hanada - Taiyo Ink Mfg. Co., Ltd.

6. Investigation of Novel Substrate Core Material Designed to Reduce Package Warpage and Improve Assembly-Level Reliability
Fumito Suzuki - Panasonic Industrial Devices Sales Company of America
Masafumi Honma - Panasonic Corporation Industrial Solutions Company
Hirofumi Midorikawa - Panasonic Corporation Industrial Solutions Company
Ryuji Takahashi - Panasonic Corporation Industrial Solutions Company
Tom Shin - Panasonic Industrial Devices Sales Company of America
Andy Behr - Panasonic Industrial Devices Sales Company of America

7. Laser Releasable Temporary Bonding Film for Fan-Out Process with Large Panel
Kyosung Hwang - 3M
Ki-sun Kim - 3M
Robin Gorrell - 3M
Keon-woo Kim - 3M
Yongsuk Yang - 3M
Wei Zou - 3M