Technical Program

Session 17: Processing Enhancements in Fan-Out and Heterogeneous Integration
Committee: Materials & Processing

Session Co-Chairs:

Qianwen Chen
IBM Research
T +1-914-945-1612
Jae Kyo Cho


1. Optimization of Temporary Carrier Technology for HDFO Packaging
JinKun Yoo - Amkor Korea Techology
DooWon Lee - Amkor Korea Techology
KiYeul Yang - Amkor Korea Techology

2. Optimization of PI & PBO Layers Lithography Process for High Density Fan-OUT Wafer Level Packaging & Next Generation Heterogeneous Integration Applications Employing Digitally Driven Maskless Lithography
Bozena Matuskova - EV Group
Boris Povazay - EV Group
Tobias Zenger - EV Group
Thomas Uhrmann - EV Group
Bernd Thallner - EV Group
Mario Reybrouck - FUJIFILM Electronic Materials (Europe) N.V.
Niels Van Herck - FUJIFILM Electronic Materials (Europe) N.V.
Bart Persijn - FUJIFILM Electronic Materials (Europe) N.V.
Dimitri Janssen - FUJIFILM Electronic Materials (Europe) N.V.
Stefan Vanclooster - FUJIFILM Electronic Materials (Europe) N.V.
Frank Bögelsack - EV Group

3. Analysis of Pattern Distortion by Panel Deformation and Solution Using Extremely Large Exposure Field Fine-Resolution Lithography in FOPLP
John Chang - Onto Innovation
James Webb - Onto Innovation
Corey Shay - Onto Innovation
Timothy Chang - Onto Innovation

4. A Novel Tool Concept for Electroplating of Advanced Panel Level Packaging Designs
Norbert Bay - RENA Technologies GmbH
John Burschik - RENA Technologies GmbH
Konrad Kaltenbach - RENA Technologies GmbH
Valeria Samsoninkova - RENA Technologies GmbH
Holger Kuehnlein - RENA Technologies GmbH

5. Reconstituted Large Diameter III-V Substrates Fabricated by Heterogeneous Integration
Ankit Kuchhangi - UCLA
Subramanian Iyer - UCLA

6. Fabrication, Characterization and Electromechanical Reliability of Stretchable Circuitry for Health Monitoring Systems
Behnam Garakani - Binghamton University
Kankanige Udara Somarathna - Binghamton University
Riadh Alheydari - Binghamton University
Firas W Alshatnawi - Binghamton University
Detlef-M Smilgies - Binghamton University
Mark D. Poliks - Binghamton University

7. Buried Power Rails and Nano-Scale TSV: Technology Boosters for Backside Power Delivery Network and 3D Heterogeneous Integration
Anne Jourdain - IMEC
Michele Stucchi - IMEC
Geert Van der Plas - IMEC
Gerald Beyer - IMEC
Eric Beyne - IMEC