Technical Program

Program Sessions: Thursday June 1st 9:30 AM – 12:35 PM

Session 17: Advanced Reliability Modelling and Characterization
Committees: Thermal/Mechanical Simulation & Characterization and Applied Reliability
Room: Palazzo C

Session Co-Chairs:

Wei Wang
Qualcomm Technologies, Inc.
Email: [email protected]

Tz-Cheng Chiu
National Cheng-Kung University
Email: [email protected]

Papers:

1. Fully Coupled Electromigration Modeling Using Peridynamics
Yanan Zhang – University of Arizona
Sundaram Vinod Anicode – University of Arizona
Erdogan Madenci – University of Arizona
Xuejun Fan – Lamar University

2. Predicting Reliability Behavior in HBM Packages Through Numerical Simulation
Sangkun O – Samsung Electronics Co., Ltd.
Jongpa Hong – Samsung Electronics Co., Ltd.
Sangmin Lee – Samsung Electronics Co., Ltd.
Seoeun Kyung – Samsung Electronics Co., Ltd.
Junho Lee – Samsung Electronics Co., Ltd.
Kilsoo Kim – Samsung Electronics Co., Ltd.
Jihyun Park – Samsung Electronics Co., Ltd.
Dan Oh – Samsung Electronics Co., Ltd.

3. Distortion Simulation for Direct Wafer-to-Wafer Bonding Process
Nathan Ip – Tokyo Electron America, Inc.
Nima Nejadsadeghi – Tokyo Electron America, Inc.
Norifumi Kohama – Tokyo Electron Kyushu, Ltd.
Hayato Tanoue – Tokyo Electron Kyushu, Ltd.
Kimio Motoda – Tokyo Electron Kyushu, Ltd.

4. Substrate Copper Trace Crack Characterization and Simulation
Wei Yu – Micron Semiconductor Asia Operations Pte. Ltd
Faxing Che – Micron Semiconductor Asia Operations Pte. Ltd
Vance Liu – Micron Memory Taiwan Co., Ltd.
Milly Lin – Micron Memory Taiwan Co., Ltd.
Jay Lin – Micron Memory Taiwan Co., Ltd.
Brad Rumsey – Micron Technology, Inc.
Christopher Glancey – Micron Technology, Inc.
Yeow Chon Ong – Micron Semiconductor Asia Operations Pte. Ltd
Hong Wan Ng – Micron Semiconductor Asia Operations Pte. Ltd

5. Design-for-Manufacturing and Design-for-Reliability Strategies for Large 80mm+ 2.5D Devices
Peng Su – Juniper Networks
Omar Ahmed – Juniper Networks
Leif Hutchinson – Juniper Networks
Bernard Glasauer – Juniper Networks
Gautam Ganguly – Juniper Networks

6. A Continuum Damage Mechanics Approach for the Reliability of Lead-Free Solders Subjected to Cyclic Loading
Golam Rakib Mazumder – Auburn University
Mohammad Ashraful Haq – Auburn University
Jeffrey Suhling – Auburn University
Pradeep Lall – Auburn University
Yaxiong Chen – NXP Semiconductor, Inc.
Torsten Hauck – NXP Semiconductor, Inc.
Abdullah Fahim – NXP Semiconductor, Inc.

7. A Quantitative Evaluation of the Inelastic Energy Absorptions in Cu-Polyimide Interconnect and the Effect on Interface Debond Driving Force
Chien-Yu Wang – National Cheng-Kung University
Tz-Cheng Chiu – National Cheng-Kung University
Wei-Jie Yin – Advanced Semiconductor Engineering, Inc.
Dao-Long Chen – Advanced Semiconductor Engineering, Inc.
Tang-Yuan Chen – Advanced Semiconductor Engineering, Inc.
Chin-Li Kao – Advanced Semiconductor Engineering, Inc.