Technical Program

Thursday, June 02, 2022

Session 18: Flexible, Wearable Sensors and Electronics
8:00 AM - 11:40 AM
Committee: Emerging Technologies
Room: Coral 3&4

Session Co-Chairs:

Chukwudi Okoro
Corning
OkoroC@corning.com
Isaac Robin Abothu
Siemens Healthineers
Isaac.abothu@siemens-healthineers.com

Papers:

1. Robustness and Reliability of Novel Anisotropic Conductive Epoxy for Stretchable Wearable Electronics
Andrew Stemmermann - SunRay Scientific, Inc.
Daniel Balder - SunRay Scientific, Inc.
Madhu Stemmermann - SunRay Scientific, Inc.
Christopher Tabor - Binghamton University
Nancy Stoffel - General Electric
Riadh Al-Haidari - Binghamton University
Behnam Garakani - Binghamton University
Udara Somarathna - Binghamton University
Mohammed Alhendi - Binghamton University
El Medhi Abbara - Binghamton University
Mark Poliks - Binghamton University

2. Wireless Nanomembrane Electronics and Soft Packaging Technologies for Noninvasive, Real-time Monitoring of Muscle Activities
Hojoong Kim - Georgia Institute of Technology
Hyojung J. Choo - Emory University
Woon-Hong Yeo - Georgia Institute of Technology

3. Modeling of Spreading Behavior of UV-Curable Dielectric Ink from its Rheological Characteristics
Sujie Kang - Samsung Electronics Co., Ltd.
Jung Shin Lee - Samsung Electronics Co., Ltd.
Jung Woo Cho - Samsung Electronics Co., Ltd.
Sun Woo Park - Samsung Electronics Co., Ltd.
Seungdon Lee - Samsung Electronics Co., Ltd.
Hyunjin Lee - Samsung Electronics Co., Ltd.
Daniel Min Woo Rhee - Samsung Electronics Co., Ltd.

4. Fabrication of Flexible Li-ion Battery Electrodes Using “Battlets” Approach with Ionic Liquid Electrolyte for Powering Wearable Devices
Guangqi Ouyang - University of California, Los Angeles
Grace Whang - University of California, Los Angeles
Emily MacInnis - University of California, Los Angeles
Haoxiang Ren - University of California, Los Angeles
Henry Sun - University of California, Los Angeles
Randall Irwin - University of California, Los Angeles
Subramanian S. Iyer - University of California, Los Angeles

5. Smart Biofeedback Earbud Achieved by SIP with 3D Composite Polymer Package
Kuei-Hao Tseng - ASE Group
Chih-Lung Lin - ASE Group
Kai-Hung Wang - ASE Group
Harrison Chang - ASE Group

6. Current Carrying Capacity of Inkjet Printed Nano-Silver Interconnects on Mesoporous PET Substrate
El Mehdi Abbara - Binghamton University
Gurvinder Singh Khinda - Binghamton University
Mohammed Alhendi - Binghamton University
Riadh Alhaidari - Binghamton University
Firas Alshatnawi - Binghamton University
Behnam Garakani - Binghamton University
Udara Somarathna - Binghamton University
Mark Poliks - Binghamton University

7. Fabrication of Wearable Strain Sensor by Using a Novel Hybrid Cu Ink Composed of Bimodal Cu Particle Ink and Cu-Based Metal-Organic Decomposition Ink
Cong Gan - South China University of Technology
Hai-Jun Huang - South China University of Technology
Bin Hou - South China University of Technology
Min-Bo Zhou - South China University of Technology
Xin-Ping Zhang - South China University of Technology