Technical Program

Session 18: Emerging technology advancements in applications and processing
Committee: Materials & Processing

Session Co-Chairs:

Bing Dang
IBM Research
T +1-914-945-1568
dangbing@us.ibm.com
Yi Li
Intel Corporation
T +1-480-554-1657
yi.li@intel.com

Papers:

1. Electromechanical Characterization of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics
Behnam Garakani - Binghamton University
K.Udara Somarathna - Binghamton University
Gurvinder Singh Khinda - Binghamton University
EL Mehdi Abbara - Binghamton University
Mark Poliks - Binghamton University
Sai Srinivas - Liquid Wire
Chuck Kinzel - Liquid Wire
Andrea Olvera Gonzales - Liquid Wire
Daniel Almeida - Liquid Wire
Mark Ronay - Liquid Wire

2. 1 μm Diameter High Aspect Ratio Via Formation on RDL Dielectric by Imprinting Technology
Shinya Kawashita - Showa Denko Materials Co.,Ltd
Kazutaka Honda - Showa Denko Materials Co.,Ltd
Masataka Nishida - Showa Denko Materials Co., Ltd.
Tatsuya Makino - Showa Denko Materials Co.,
Naoya Suzuki - Showa Denko Materials Co.,

3. Selective Thinning Technology of Solder Resist for Ultra-Thin and High-Density Packaging
Yuya Suzuki - Taiyo America
Yuji Toyoda - Mitsubishi Paper Mills Limited

4. Novel Silicone Hotmelt Solutions for Electronic Components
Ryosuke Yamazaki - Dow Toray Co., Ltd.
Kouichi Ozaki - Dow Toray Co., Ltd.
Toru Imaizumi - Dow Toray Co., Ltd.
Hidenori Matsushima - Dow Toray Co., Ltd.
Masayuki Hayashi - Dow Toray Co., Ltd.
Shinichi Yamamoto - Dow Toray Co., Ltd.
Yoshito Ushio - Dow Toray Co., Ltd.

5. Extreme Thin Peltier Modules Fabricated by the Printed Electronics Method
Yuta Seki - LINTEC Corporation
Toshiya Yamasaki - LINTEC Corporation
Masaya Todaka - LINTEC Corporation
Wataru Morita - LINTEC Corporation
Kunihisa Kato - LINTEC Corporation
Tsuyoshi Muto - LINTEC Corporation

6. A Novel Integration Scheme for Wafer Singulation and Selective Processing Using Temporary Dry Film Resist
Alexandre La Grappe - IMEC
Evert Visker - IMEC
Augusto Redolfi - IMEC
Lan Peng - IMEC
Karthik Muga - IMEC
David Huls - IMEC
Serge Vanhaelemeersch - IMEC
Anne Lauwers - IMEC
Jan Ackaert - IMEC

7. Study on EMI Shielding at the PCB Strip Level with Conformal Spray Coating Process
Sang Won Park - Ntrium Inc.
Jin-Ho Yoon - Ntrium Incorporation
Byoung Woong Moon - Ntrium Incorporation
Ho Yeong Jeong - Ntrium Incorporation
Se Young Jeong - Ntrium Incorporation
Seung Jae Lee - Ntrium Incorporation
Kisu Joo - Ntrium Incorporation