Technical Program

Session 19: Enhanced Reliability Characterization and Methodologies
Committee: Applied Reliability

Session Co-Chairs:

Darvin R. Edwards
Edwards Enterprise Consulting, LLC
T +1-972-571-7638
darvin.edwards1@gmail.com
Pilin Liu
Intel Corporation
T +1-480-570-7670
pilin.liu@intel.com

Papers:

1. Magnetically Actuated Test Method for Interfacial Fracture Reliability Assessment
Rui Chen - Georgia Institute of Technology
Nicholas Ginga - Georgia Institute of Technology
Suresh Sitaraman - Georgia Institute of Technology

2. Evaluation of Low-k Integration Integrity Using Shear Testing on Sub-30 Micron Micro-Cu Pillars
Tae-Kyu Lee - Portland State University
Greg Baty - Portland State University
Omar Ahmed - Juniper Networks
Peng Su - Juniper Networks
Bernard Glasauer - Juniper Networks

3. A Fracture Mechanics Evaluation of the Cu-Polyimide Interface in Fan-Out Redistribution Interconnect
Wei-Te Liu - National Cheng Kung University
Chia-Ming Yang - National Cheng Kung University
Tz-Cheng Chiu - National Cheng Kung University
Dao-Long Chen - Advanced Semiconductor Engineering, Inc.
Ching-Lin Hsiao - Advanced Semiconductor Engineering, Inc.
David Tarng - Advanced Semiconductor Engineering, Inc.

4. Novel in-situ Button Shear Methodology for Efficient Assessment of Mold Compound Encapsulation
David Guillon - Hitachi ABB Power Grids
Andris Avots - Hitachi ABB Power Grids
Katrin Schlegel - Hitachi ABB Power Grids

5. Low-Temperature High Strain Rate Constitutive Behavior of Doped and Undoped SnAgCu Solder Alloys after Prolonged Storage at High Temperature
Pradeep Lall - Auburn University
Vikas Yadav - Auburn University
Vishal Mehta - Auburn University
Jeff Suhling - Auburn University

6. Automated Void Detection in TSVs from 2D X-Ray Scans using Supervised Learning with 3D X-Ray Scans
64082441 Pahwa - Institute for Infocomm Research
Saisubramaniam Gopalakrishnan - Institute for Infocomm Research
Huang Su - Institute for Infocomm Research
Ee Ping Ong - Institute for Infocomm Research
Soon Wee Ho - Institute of Microelectronics
Thomas Gregorich - Carl Zeiss SMT, Inc.
Vempati Srinivasa Rao - Institute of Microelectronics
Haiwen Dai - Carl Zeiss SMT, Inc.
Ramani Pichumani - Carl Zeiss SMT, Inc.
Jens Timo Neumann - Carl Zeiss SMT, Inc.

7. Case Studies of Accurate Fault Localization in Advanced Packages
Sajay Bhuvanendran Nair Gourikutty - Institute of Microelectronics, A*STAR
Jesse Alton - TeraView Limited
Kok Keng Chua - Xilinx, Inc.
Sharon Lim Seow Huang - Institute of Microelectronics, A*STAR
Surya Bhattacharya - Institute of Microelectronics, A*STAR