Technical Program

Program Sessions: Thursday June 1st 2:00 PM — 5:05 PM

Session 19: Advances in 3D Integration and Hybrid Bonding
Committee: Packaging Technologies
Room: Palazzo D

Session Co-Chairs:

Peng Su
Juniper Networks
Email: [email protected]

Jaesik Lee
Meta Platforms, Inc.
Email: [email protected]

Papers:

1. Thermal Improvement of HBM With Joint Thermal Resistance Reduction for Scaling 12 Stacks and Beyond
Taehwan Kim — Samsung Electronics Co., Ltd.
Youngdeuk Kim — Samsung Electronics Co., Ltd.
Heejung Hwang — Samsung Electronics Co., Ltd.
Hwanjoo Park — Samsung Electronics Co., Ltd.
Jaechoon Kim — Samsung Electronics Co., Ltd.
Dan (Kyung Suk) Oh — Samsung Electronics Co., Ltd.

2. Electrical and Thermal Analysis of Bumpless Build Cube (BBCube) 3D Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Near Memory Computing
Norio Chujo — Hitachi Research & Development Group/Tokyo Institute of Technology
Hiroyuki Ryoson — Tokyo Institute of Technology
Tomoji Nakamura — Tokyo Institute of Technology
Koji Sakui — Tokyo Institute of Technology
Shinji Sugatani — Tokyo Institute of Technology
Takayuki Ohba — Tokyo Institute of Technology

3. 2.5D MCM (Multi-Chip Module) Technology Development for Advanced Package
Laurene Yip — MediaTek, Inc.
James Tsai — MediaTek, Inc.
Rosa Lin — MediaTek, Inc.
Ian Hsu — MediaTek, Inc.

4. Reliability Performance on Low Temperature Fine-Pitch SoICTM Bond
Shih-Wei Liang — Taiwan Semiconductor Manufacturing Company, Ltd.
Y. R. Liang — Taiwan Semiconductor Manufacturing Company, Ltd.
Gene C. Y. Wu — Taiwan Semiconductor Manufacturing Company, Ltd.
K. C. Yee — Taiwan Semiconductor Manufacturing Company, Ltd.
C. T. Wang — Taiwan Semiconductor Manufacturing Company, Ltd.
Douglas C. H. Yu — Taiwan Semiconductor Manufacturing Company, Ltd.

5. Development of 4 Die Stack Module Using Hybrid Bonding Approach
Ser Choong Chong — Institute of Microelectronics A*STAR
Au Keng Yuen, Jason — Institute of Microelectronics A*STAR
Nagendra Sekhar Vasarla — Institute of Microelectronics A*STAR
Ismael Daniel Cereno — Institute of Microelectronics A*STAR
Srinivasa Rao Vempati — Institute of Microelectronics A*STAR

6. Impact of Dielectric Types and Surface Profile on Wafer-to-Wafer Hybrid Bonding
Vikas Dubey — Fraunhofer ENAS
Dirk Wuensch — Fraunhofer ENAS
Knut Gottfried — Fraunhofer ENAS
Tobias Fischer — Fraunhofer ENAS
Maik Wiemer — Fraunhofer ENAS
Harald Kuhn — Fraunhofer ENAS

7. Voids-Free Die-Level Cu/ILD Hybrid Bonding
Katsuyuki Sakuma — IBM Research
Roy Yu — ASM Pacific Technology, Ltd.
John Knickerbocker — ASM Pacific Technology, Ltd.
Dale McHerron — ASM Pacific Technology, Ltd.
Ming Li — ASM Pacific Technology, Ltd.
Siu Cheung So — ASM Pacific Technology, Ltd.
So Ying Kwok — ASM Pacific Technology, Ltd.
Chun Ho Fan — ASM Pacific Technology, Ltd.
Siu Wing Lau — ASM Pacific Technology, Ltd.