Technical Program

Program Sessions: Wednesday May 31st 9:30 AM — 12:35 PM

Session 2: High-Performance Packaging Materials
Committee: Materials & Processing
Room: Palazzo A & B

Session Co-Chairs:

Yoichi Taira
Keio University
Email: [email protected]

Yi Li
Intel Corporation
Email: [email protected]

Papers:

1. High Modulus Photosensitive Permanent Film Utilizing Novel Polymerization System for Advanced MEMS Structure Fabrication
Ken-ichi Yamagata — Tokyo Ohka Kogyo Co., Ltd.
Shiori Yuge — Tokyo Ohka Kogyo Co., Ltd.
Ryosuke Nakamura — Tokyo Ohka Kogyo Co., Ltd.
HIrofumi Imai — Tokyo Ohka Kogyo Co., Ltd.

2. Lithographic Performance and Insulation Reliability of a Novel i-Line Photosensitive Dielectric Material
Go Inoue — TAIYO HOLDINGS Co., Ltd.
Daiki Yukimori — TAIYO HOLDINGS Co., Ltd.
Kaho Shibasaki — TAIYO HOLDINGS Co., Ltd.
Ayano Okuda — TAIYO HOLDINGS Co., Ltd.
Nobuhiro Ishikawa — TAIYO HOLDINGS Co., Ltd.
Toshiyuki Ogata — TAIYO HOLDINGS Co., Ltd.

3. Effect of Surface Roughness of Polymer Dielectric Materials on Resolution of Fine Line Features
Pragna Bhaskar — Georgia Institute of Technology
Mohanalingam Kathaperumal — Georgia Institute of Technology
Mark Losego — Georgia Institute of Technology
Madhavan Swaminathan — Georgia Institute of Technology

4. A Novel High Reliability and Low Dk/Df Dielectric Material for 5G mmWave and HPC
Kaori Hamada — NAMICS Corporation
Hiroshi Ozaki — NAMICS Corporation
Toshiyuki Sato — NAMICS Corporation
Shin Teraki — NAMICS Corporation
Fumikazu Komatsu — NAMICS Corporation
Masaki Yoshida — NAMICS Corporation
Hirotatsu Ikarashi — NAMICS Corporation

5. Single-Layer Release Material Having Laser Lift-Off and Chip Fixing Property for FO-WLP Chip First Process
Okuno Takahisa — Nissan Chemical Industries
Shinjo Tetsuya — Nissan Chemical Industries
Usui Yuki — Nissan Chemical Industries
Fukuda Takuya — Nissan Chemical Industries
Yanai Masaki — Nissan Chemical Industries
Yagyu Masafumi — Nissan Chemical Industries

6. Novel Photosensitive Polyimides Compositions With Low Dielectric Property and Good Flexibility Corresponding to Redistribution Layers for Advanced Heterogeneous Integration Packages
Takashi Tazaki — Arakawa Chemical Industries, Ltd.
Takashi Yamaguchi — Arakawa Chemical Industries, Ltd.
Taiyo Nakamura — Arakawa Chemical Industries, Ltd.
Madoka Yamashita — Arakawa Chemical Industries, Ltd.

7. High Frequency Characteristics of Fine Copper Lines on High Rigidity Dielectrics
Masataka Nishida — Showa Denko Materials Co., Ltd.
Hirokazu Noma — Showa Denko Materials Co., Ltd.
Tetsuro Iwakura — Showa Denko Materials Co., Ltd.
Masaki Yamaguchi — Showa Denko Materials Co., Ltd.
Kazuyuki Mitsukura — Showa Denko Materials Co., Ltd.