Technical Program

Program Sessions: Wednesday May 31st 9:30 AM – 12:35 PM

Session 2: High-Performance Packaging Materials
Committee: Materials & Processing
Room: Palazzo A & B

Session Co-Chairs:

Yoichi Taira
Keio University
Email: [email protected]

Kimberly Yess
Brewer Science, Inc.
Email: [email protected]

Papers:

1. High Modulus Photosensitive Permanent Film Utilizing Novel Polymerization System for Advanced MEMS Structure Fabrication
Ken-ichi Yamagata – Tokyo Ohka Kogyo Co., Ltd.
Shiori Yuge – Tokyo Ohka Kogyo Co., Ltd.
Ryosuke Nakamura – Tokyo Ohka Kogyo Co., Ltd.
HIrofumi Imai – Tokyo Ohka Kogyo Co., Ltd.

2. Lithographic Performance and Insulation Reliability of a Novel i-Line Photosensitive Dielectric Material
Go Inoue – TAIYO HOLDINGS Co., Ltd.
Daiki Yukimori – TAIYO HOLDINGS Co., Ltd.
Kaho Shibasaki – TAIYO HOLDINGS Co., Ltd.
Ayano Okuda – TAIYO HOLDINGS Co., Ltd.
Nobuhiro Ishikawa – TAIYO HOLDINGS Co., Ltd.
Young-Gun Han – Fukuoka University
Taka Kanayama – Fukuoka University
Tadashi Suetsugu – Fukuoka University
Toshiyuki Ogata – TAIYO HOLDINGS Co., Ltd.

3. Effect of Surface Roughness of Polymer Dielectric Materials on Resolution of Fine Line Features
Pragna Bhaskar – Georgia Institute of Technology
Mohanalingam Kathaperumal – Georgia Institute of Technology
Christopher Blancher – Georgia Institute of Technology
Mark Losego – Georgia Institute of Technology
Madhavan Swaminathan – Georgia Institute of Technology

4. Novel High Reliability and Low Dk/Df Dielectric RDL Material for High Frequency 5G Applications
Kaori Hamada – NAMICS Corporation
Hiroshi Ozaki – NAMICS Corporation
Toshiyuki Sato – NAMICS Corporation
Shin Teraki – NAMICS Corporation
Fumikazu Komatsu – NAMICS Corporation
Masaki Yoshida – NAMICS Corporation
Hirotatsu Ikarashi – NAMICS Corporation

5. Single-Layer Release Material Having Laser Lift-Off and Chip Fixing Property for FO-WLP Chip First Process
Okuno Takahisa – Nissan Chemical Industries
Shinjo Tetsuya – Nissan Chemical Industries
Usui Yuki – Nissan Chemical Industries
Fukuda Takuya – Nissan Chemical Industries
Yanai Masaki – Nissan Chemical Industries
Yagyu Masafumi – Nissan Chemical Industries

6. Novel Photosensitive Polyimides Compositions with Low Dielectric Property and Good Flexibility Corresponding to Redistribution Layers for High Speed Transmission Applications
Takashi Tazaki – Arakawa Chemical Industries, Ltd.
Takashi Yamaguchi – Arakawa Chemical Industries, Ltd.
Taiyo Nakamura – Arakawa Chemical Industries, Ltd.
Madoka Yamashita – Arakawa Chemical Industries, Ltd.

7. High Frequency Characteristics of Fine Copper Lines on High Rigidity Dielectrics
Masataka Nishida – Resonac Corporation
Hirokazu Noma – Resonac Corporation
Tetsuro Iwakura – Resonac Corporation
Masaki Yamaguchi – Resonac Corporation
Kazuyuki Mitsukura – Resonac Corporation