Technical Program
Session 2: Wafer/Panel Level System Integration and Process Advances
Committee: Packaging Technologies
Session Co-Chairs:
|
Raj Pendse Facebook FRL (Facebook Reality Labs) T +1-(510)709-8076 rajd@fb.com |
Kuo-Chung Yee Taiwan Semiconductor Manufacturing Corporation, Inc. T +886-3-5636688 Ext. 7222920/7223012 kcyee@tsmc.com |
Papers:
1. Deca & Cadence Breakthrough Heterogeneous Integration Barriers with Adaptive Patterning
Dan Baldwin - Cadence
2. nSiP(System in Package) Platform for Various Module Packaging Applications
Lewis(In Soo) Kang - NEPES Corporation
WS Shin - NEPES Corporation
JK Lee - NEPES Corporation
Jay Kim - NEPES Corporation
NamChul Kim - NEPES Corporation
SY Park - NEPES Corporation
3. Chip-Last HDFO (High Density Fan-Out) Interposer PoP
JaeYoon Kim - Amkor Technology
KyeRyung Kim - Amkor Technology
EunYoung Lee - Amkor Technology
SeHwan Hong - Amkor Technology
JiHyun Kim - Amkor Technology
JiYeon Ryu - Amkor Technology
JiHun Lee - Amkor Technology
David Hiner - Amkor Technology
WonChul Do - Amkor Technology
JinYoung Khim - Amkor Technology
4. The Influence of Scaling BEOL Layer Thicknesses on Crackstops’ Mechanical Strength
Nicholas Polomoff - GLOBALFOUNDRIES
Mohamed Rabie - GLOBALFOUNDRIES
5. Advanced Outlier Die Control Technology in Fan-Out Panel Level Packaging Using Feedforward Lithography
Amr Hafez - Onto Innovation
Jian Lu - Onto Innovation
Burhan Ali - Onto Innovation
6. A High Performance Package with Fine-Pitch RDL Quality Management
Jen-Kuang Fang - Advanced Semiconductor Engineering, Inc.
Cher-Min Fong - National Sun Yat-sen University
Jhao-Cheng Chen - Advanced Semiconductor Engineering, Inc.
Huang-Hsieh Chang - Advanced Semiconductor Engineering, Inc.
Peng Yang - Advanced Semiconductor Engineering, Inc.
Wen-Long Lu - Advanced Semiconductor Engineering, Inc.
Hung-Jung Tu - Advanced Semiconductor Engineering, Inc.
Min-Lung Huang - Advanced Semiconductor Engineering, Inc.
7. Reliability Considerations for Wafer Scale Systems
Niloofar Shakoorzadeh - University of California, Los Angeles
Randall Irwin - University of California, Los Angeles
Yu-Tao Yang - University of California, Los Angeles
Haoxiang Ren - University of California, Los Angeles
Subramanian S. Iyer - University of California, Los Angeles
