Technical Program

Program Sessions: Thursday June 1st 2:00 PM — 5:05 PM

Session 21: Fine-Pitch and Intermetallic Considerations in Advanced Solder Interconnections
Committee: Interconnections
Room: Mediterranean 2 & 3

Session Co-Chairs:

Nathan Lower
Consultant
Email: [email protected]

Jian Cai
Tsinghua University
Email: [email protected]

Papers:

1. Copper Pillar Voids in a Flip Chip Package During High Temperature Application
Miao Wang — NXP Semiconductor, Inc.
Amar Mavinkurve — NXP Semiconductor, Inc.
Romuald Roucou — NXP Semiconductor, Inc.
Amirul Afripin — NXP Semiconductor, Inc.
CS Foong — NXP Semiconductor, Inc.
Trent Uehling — NXP Semiconductor, Inc.
Nishant Lakhera — NXP Semiconductor, Inc.

2. Solder Joint Reliability of Fully Homogenised SAC-SnBi Low Temperature BGA Interconnections Using Solid Liquid Inter-Diffusion (SLID)
Hafiz Waqas Ali — University of Sherbrooke
David Danovitch — University of Sherbrooke
Richard Langlois — IBM Corporation
Robert Martel — IBM Corporation

3. Intermetallic Growth Study of Ultra-Thin Copper and Tin Bilayer for Hybrid Bonding Applications
Gaurav Khurana — Dresden University of Technology
Iuliana Panchenko — Dresden University of Technology/Fraunhofer IZM

4. Heterogeneous Integration on Organic Interposer Substrate With Fine-Pitch RDL and 40 µm Pitch Micro-Bumps
Katsuyuki Sakuma — IBM Research
Russell Kastberg — IBM Systems
Toyohiro Aoki — IBM Japan, Ltd.
Griselda Bonilla — IBM Research

5. A Study on the Advanced Chip to Wafer Stack for Better Thermal Dissipation of High Bandwidth Memory
Sangyong Lee — SK Hynix, Inc.
Jinwoo Park — SK Hynix, Inc.
Jong-Kyu Moon — SK Hynix, Inc.
Minsuk Kim — SK Hynix, Inc.
Gyujei Lee — SK Hynix, Inc.
Kangwook Lee — SK Hynix, Inc.

6. Morphological and Electrical Characterization of Hard Material Microtubes Insertion in Aluminum and Indium Pads for 10 µm, 7.5 µm and 5 µm Pitches Interconnection Technology
Natacha Raphoz — University of Grenoble Alpes/CEA-LETI
Patrick Peray — University of Grenoble Alpes/CEA-LETI
Olivier Mailliart — University of Grenoble Alpes/CEA-LETI
Frederic Berger — University of Grenoble Alpes/CEA-LETI
Cloe Desbordes — University of Grenoble Alpes/CEA-LETI

7. Develpoment of Fluxless Micro-Bonding and Narrow Gap Filling Process
Sadaaki Katoh — Showa Denko Materials Co., Ltd.
Dongchul Kan — Showa Denko Materials Co., Ltd.
Keiko Ueno — Showa Denko Materials Co., Ltd.
Kazuyuki Mitsukura — Showa Denko Materials Co., Ltd.