Technical Program

Program Sessions: Thursday June 1st 2:00 PM — 5:05 PM

Session 23: Next Generation Quantum, AI, and Secure System Design
Committee: Emerging Technologies
Room: Mediterranean 6

Session Co-Chairs:

Rohit Sharma
Indian Institute of Technology Ropar
Email: [email protected]

Santosh Kudtarkar
Analog Devices, Inc.
Email: [email protected]

Papers:

1. Thermal-Aware SoC Macro Placement and Multi-Chip Module (MCM) Package Design With Mixed-Variable Bayesian Optimization
Michael Molter — University of Illinois
Rahul Kumar — Georgia Institute of Technology
Sonja Koller — Intel Corporation
Osama Waqar Bhatti — Georgia Institute of Technology
Elyse Rosenbaum — University of Illinois
Madhavan Swaminathan — Georgia Institute of Technology

2. 3D Defect Detection and Metrology of HBMs Using Semi-Supervised Deep Learning
Ramanpreet Pahwa — Institute for Infocomm Research A*STAR
Richard Chang — Institute for Infocomm Research A*STAR
Jie Wang — Institute for Infocomm Research A*STAR
Ziyuan Zhao — Institute for Infocomm Research A*STAR
Chuan Sheng Foo — Institute for Infocomm Research A*STAR
Xun Xu — Institute for Infocomm Research A*STAR
Lile Cai — Institute for Infocomm Research A*STAR
Kangkang Lu — Institute for Infocomm Research A*STAR
Sharon Lim — Institute of Microelectronics A*STAR
Ser Choong Chong — Institute of Microelectronics A*STAR
Vempati Srinivasa Rao — Institute of Microelectronics A*STAR

3. A Si-Interposer With Buried Cu Metal Stripes and Bonded to Si-Substrate Backside for Security IC Chips
Takuya Wadatsumi — Kobe University
Rikuu Hasegawa — Kobe University
Kazuki Monta — Kobe University
Takaaki Okidono — SCU Co., Ltd.
Takuji Miki — Kobe University
Makoto Nagata — Kobe University

4. Physical Authentication of Electronic Devices Using Synthetically Generated 3D Material Signatures
Tejas Ravindra Kulkarni — Purdue University
Nikhilesh Chawla — Purdue University
Ganesh Subbarayan — Purdue University

5. Modeling and Analysis of CMOS-based Folded Memristive Crossbar Array for 3D Neuromorphic Integrated Circuits
Sherin A. Thomas — Indian Institute of Technology Ropar
Sahibia Kaur Vohra — Indian Institute of Technology Ropar
Suyash Kushwaha — Indian Institute of Technology Ropar
ROHIT SHARMA — Indian Institute of Technology Ropar
Devarshi Mrinal Das — Indian Institute of Technology Ropar

6. Cryogenic Integration for Quantum Computer Using Diamond Color Center Spin Qubits
Toshiki Iwai — Fujitsu, Ltd.
Kenichi Kawaguchi — Fujitsu, Ltd.
Tetsuya Miyatake — Fujitsu, Ltd.
Tetsuro Ishiguro — Fujitsu, Ltd.
Shoichi Miyahara — Fujitsu, Ltd.
Salahuddin Nur — Delft University of Technology
Ryoichi Ishihara — Delft University of Technology
Shintaro Sato — Fujitsu, Ltd.

7. Characterizations of Indium Interconnects for 3D Quantum Assemblies
Celine Feautrier — CEA-LETI
Edouard Deschaseaux — CEA-LETI
Alain Gueugnot — CEA-LETI
Jean Charbonnier — CEA-LETI
Aurelia Plihon — CEA-LETI
Ludovic Dupre — CEA-LETI
Franck Henry — CEA-LETI
Frederic Berger — CEA-LETI
Antoine Pagot — CEA-LETI
Sebastien Renet — CEA-LETI
Olivier Mailliart — CEA-LETI
Candice Thomas — CEA-LETI