Technical Program

Thursday, June 02, 2022

Session 23: Advanced Processes for Manufacturing and Yield Enhancement
1:30 PM - 5:10 PM
Committee: Assembly & Manufacturing Technology
Room: Coral 3&4

Session Co-Chairs:

Mark Gerber
Advanced Semiconductor Engineering Inc.
mark.gerber@aseus.com
Ralph Zoberbier
Evatec AG
ralph.zoberbier@evatecnet.com

Papers:

1. Demonstration of Flexible Encapsulation in Assembly Industry
Chao-Wei Liu - ASE Group
Ming-Hung Chen - ASE Group
Tun-Ching Pi - ASE Group
Jen-Chieh Kao - ASE Group
Yung-I Yeh - ASE Group

2. Pretreatment and Structuring of Spatial Circuit Carriers Based on Alumina for High Temperatures and High Frequencies
Philipp Braeuer - Institute FAPS, FAU
Thomas Stoll - Institute FAPS, FAU
Martin Muckelbauer - Institute FAPS, FAU
Alexander Hensel - Institute FAPS, FAU
Joerg Franke - Institute FAPS, FAU

3. 10µm Pitch Bumping of Singulated Die Using a Temporary Metal-Embedded Chip Assembly Process
Souheil Nadri - HRL Laboratories, LLC
Clayton Tu - HRL Laboratories, LLC
Florian Herrault - HRL Laboratories, LLC
Courtney Wilt - HRL Laboratories, LLC
Partia Naghibi - HRL Laboratories, LLC
Marko Pavlov - HRL Laboratories, LLC
Joel Wong - HRL Laboratories, LLC
Vu Phan - HRL Laboratories, LLC

4. Realization of High A/R and Fine Pitch Cu Pillars Incorporating High Speed Electroplating with Novel Strip Process
Se-Chul Park - Samsung Electronics Co., Ltd.
Jong-Ho Park - Samsung Electronics Co., Ltd.
Seonghoon Bae - Samsung Electronics Co., Ltd.
Jun-young Park - Samsung Electronics Co., Ltd.
Taehwa Jeong - Samsung Electronics Co., Ltd.
Hyojin Yun - Samsung Electronics Co., Ltd.
Kwangok Jeong - Samsung Electronics Co., Ltd.
Seokbong Park - Samsung Electronics Co., Ltd.
Ju-il Choi - Samsung Electronics Co., Ltd.
Un-Byoung Kang - Samsung Electronics Co., Ltd.
Dongwoo Kang - Samsung Electronics Co., Ltd.

5. High Density Thin Film Flex Technology for Advanced Packaging Applications
Kai Zoschke - Fraunhofer IZM
Hermann Oppermann - Fraunhofer IZM
Markus Wöhrmann - Fraunhofer IZM
Christine Kallmayer - Fraunhofer IZM
Christian Tschoban - Fraunhofer IZM
Kevin Kröhnert - Fraunhofer IZM
Christina Lopper - Fraunhofer IZM
Danny Jaeger - Fraunhofer IZM
Mario Lutz - Fraunhofer IZM
Olaf Wünsch - Fraunhofer IZM

6. 300mm Full Thickness Si Based IC Singulation Using Plasma Dicing for Advanced Packaging Technologies
Rajesh Surapaneni - Intel Corporation
Julia Chiu - Intel Corporation
Brad Hamlin - Intel Corporation
Richard Barnett - KLA Corporation
Matthew Muggeridge - KLA Corporation
Hannah Bhasker - KLA Corporation
Xavier Brun - Intel Corporation
N. Richards - KLA Corporation

7. Investigation of Low-k WLCSP Die Strength Impact Induced by Singulation Process
C. C. Chen - Taiwan Semiconductor Manufacturing Company, Ltd.
Y. S. Wu - Taiwan Semiconductor Manufacturing Company, Ltd.
K. H. Chen - Taiwan Semiconductor Manufacturing Company, Ltd.
W. S. Tseng - Taiwan Semiconductor Manufacturing Company, Ltd.
P. H. Tsao - Taiwan Semiconductor Manufacturing Company, Ltd.
S. T. Leu - Taiwan Semiconductor Manufacturing Company, Ltd.