Technical Program

Session 23: Heterogeneous Integration Processes and Manufacturing
Committee: Assembly & Manufacturing Technology

Session Co-Chairs:

Habib Hichri
Ajinomoto Fine-Techno USA Corporation
T +1 408 564 7245
hichrih@ajiusa.com
Yu Wang
Sensata Technologies
T +1-508-236-1552
yu.wang9@gmail.com

Papers:

1. Hybrid Bonding Interconnect for Advanced Heterogeneously Integrated Processors
Adel Elsherbini - Intel Corporation
Shawna Liff - Intel Corporation
Johanna Swan - Intel Corporation
Kimin Jun - Intel Corporation
Sathya Tiagaraj - Intel Corporation
Gerald Pasdast - Intel Corporation

2. Advanced 2.5D Heterogeneous Integrated Platform Using Flexible Biocompatible Substrate for Biomedical Sensing System
Shu-Yun Ku - National Chiao Tung University
Tzu-Chieh Chou - National Chiao Tung University
Yi-Chieh Tsai - National Chiao Tung University
Tzu-Chieh Chou - National Chiao Tung University
Han-Wen Hu - National Chiao Tung University
Yu-Ren Fang - National Chiao Tung University
Yu-Ju Lin - National Chiao Tung University
Po-Tsang Huang - National Chiao Tung University
Jin-Chern Chiou - National Chiao Tung University
Kuan-Neng Chen - National Chiao Tung University

3. Improving FC Process for Large 2.5D Molded Interposer
Dongwon Lee - Samsung Electronics Company, Ltd.
Soomin Yoon - Samsung Electronics Company, Ltd.
Joonho Jun - Samsung Electronics Company, Ltd.
Jinwoo Park - Samsung Electronics Company, Ltd.
Teakhoon Lee - Samsung Electronics Company, Ltd.
Un-Byoung Kang - Samsung Electronics Company, Ltd.
Jongho Lee - Samsung Electronics Company, Ltd.

4. High-speed, High-density, and Highly manufacturable Cu-filled Through-Glass-Via Channel (Cu bridge) for Multi-chiplet Modules
Hiroshi Kudo - Dai Nippon Printing Co., Ltd.
Takamasa Takano - Dai Nippon Printing Co., Ltd.
Miyuki Akazawa - Dai Nippon Printing Co., Ltd.
Shouhei Yamada - Dai Nippon Printing Co., Ltd.
Kouji Sakamoto - Dai Nippon Printing Co., Ltd.
Daisuke Kitayama - Dai Nippon Printing Co., Ltd.
Haruo Iida - Dai Nippon Printing Co., Ltd.
Masaya Tanaka - Dai Nippon Printing Co., Ltd.
Takahiro Tai - Dai Nippon Printing Co., Ltd.

5. Heterogeneous Integration of Double Side SiP for IoT and 5G Application
Mike Tsai - Siliconware Precision Industries Co., Ltd
Ryan Chiu - Siliconware Precision Industries Co., Ltd
Ming-Fan Tsai - Siliconware Precision Industries Co., Ltd
Eric He - Siliconware Precision Industries Co., Ltd
Erico Yang - Siliconware Precision Industries Co., Ltd.
Tim Chang - Siliconware Precision Industries Co., Ltd
Frank Chu - Siliconware Precision Industries Co., Ltd
J. Y. Chen - Siliconware Precision Industries Co., Ltd

6. Simulation and Experiment on Warpage of Heterogeneous Integrated Fan-Out Panel Level Package
Guoliang Xu - Wuhan University
Chao Sun - Wuhan University
Jiaqi Ding - Wuhan University
Sheng Liu - Wuhan University
Ziliang Kuang - Guangdong University of Technology,
Li Liu - Wuhan University of Technology
Zhiwen Chen - Wuhan University of Technology

7. CFD Simulation Analysis and Experimental Study of Capillary Underfill Flow in Heterogeneous Integration
Risa Miyazawa - IBM Corporation
Chinami Marushima - IBM Corporation
Toyohiro Aoki - IBM Corporation
Akihiro Horibe - IBM Corporation
Takashi Hisada - IBM Corporation