Technical Program

Thursday, June 02, 2022

Session 24: Thermal Management and Warpage Analysis of Highly Integrated Packages
1:30 PM - 5:10 PM
Committee: Thermal/Mechanical Simulation & Characterization
Room: Coral 5

Session Co-Chairs:

Karsten Meier
Technische Universität Dresden
[email protected] 		Suresh K. Sitaraman
Georgia Institute of Technology
[email protected]

Papers:

1. Thermal Challenges and Design Considerations in Heterogeneous Integrated Through-Silicon-Interposer Platform with Flipped III-V HEMT Chiplets
Haoran Chen - Institute of Microelectronics (IME), A*STAR
Teck Guan Lim - Institute of Microelectronics (IME), A*STAR
Gongyue Tang - Institute of Microelectronics (IME), A*STAR

2. Assessment of Thermal-Aware Floorplans in a 3D IC for Server Applications
Ki Wook Jung - Samsung Electronics Co., Ltd.
Sungeun Jo - Samsung Electronics Co., Ltd.
Minwoo Cho - Samsung Electronics Co., Ltd.
Seunggeol Ryu - Samsung Electronics Co., Ltd.
Sunggu Kang - Samsung Electronics Co., Ltd.
Jaechoon Kim - Samsung Electronics Co., Ltd.
Dan (Kyung Suk) Oh - Samsung Electronics Co., Ltd.

3. Effect of Storage on Reliability of Thin-Flexible Laminated and Unlaminated Batteries in Wearable Applications
Pradeep Lall - Auburn University
Ved Soni - Auburn University

4. Modeling and Design for System-Level Reliability and Warpage Mitigation of Large 2.5D Glass BGA Packages
Vidya Jayaram - Georgia Institute of Technology
Omkar Gupte - Georgia Institute of Technology
Vanessa Smet - Georgia Institute of Technology

5. Effective Computational Models for Addressing Asymmetric Warping of Fan-Out Reconstituted Wafer Packaging
Yu-Chin Lee - National Cheng-Kung University
Chia-Yu Chen - National Cheng-Kung University
Kuo-Shen Chen - National Cheng-Kung University
Jen-Hsien Wong - ASE Group
Wei-Hong Lai - ASE Group
Tang-Yuan Chen - ASE Group
Dao-Long Chen - ASE Group
David Tarng - ASE Group

6. Warpage and RDL Stress Analysis in Large Fan-Out Package with Multi-chiplet Integration
Jen-Hsien Wong - ASE Group
NanYi Wu - ASE Group
Wei-Hong Lai - ASE Group
Chung-Hao Chen - ASE Group
Yi-Hsien Wu - ASE Group
Tang-Yuan Chen - ASE Group
Teck Chong Lee - ASE Group
Chin-Li Kao - ASE Group
C. P. Hung - ASE Group

7. The Optimal Solution of Fan-Out Embedded Bridge (FO-EB) Package Evaluation during the Process and Reliability Test
David Lai - Siliconware Precision Industries Co., Ltd.
Yu-Po Wang - Siliconware Precision Industries Co., Ltd.