Technical Program

Session 24: Fan-Out Wafer Level Packaging Developments and Applications
Committee: Assembly & Manufacturing Technology

Session Co-Chairs:

Jan Vardaman
Techsearch International
Paul Tiner
Texas Instruments
T +1-469-471-3565


1. Multi-Tier N=4 Binary Stacking, Combining Face-to-Face and Back-to-Back Hybrid Wafer-to-Wafer Bonding Technology
Stefaan Van Huylenbroeck - IMEC
Joeri De Vos - IMEC
Lieve Teugels - IMEC
Serena Iacovo - IMEC
Ferenc Fodor - IMEC
Andy Miller - IMEC
Geert Van der Plas - IMEC
Gerald Beyer - IMEC
Eric Beyne - IMEC

2. 600mm FOPLP As A Scale Up Alternative to 300mm FOWLP
Jacinta Aman Lim - nepes Corporation

3. Demonstration of Fine Pitch RDL in Fan-Out Panel Level Packaging
Dowan Kim - Samsung Electronics Company, Ltd.
Seokbong Park - Samsung Electronics Company, Ltd.
Mina Heo - Samsung Electronics Company, Ltd.
Daeyeon Choi - Samsung Electronics Company, Ltd.

4. A Novel Multi-Chip Stacking Technology Development Using a Flip-Chip Embedded Interposer Carrier Integrated in Fan-Out Wafer-Level Packaging
Yu-Min Lin - Industrial Technology Research Institute
Wei-Lan Chiu - Industrial Technology Research Institute
Sheng-Tsai Wu - Industrial Technology Research Institute
Chao-Jung Chen - Industrial Technology Research Institute
Tao-Chih Chang - Industrial Technology Research Institute
Hsiang-Hung Chang - Industrial Technology Research Institute
Chia-Hsin Lee - Brewer Science, Inc.
Xiao Liu - Brewer Science, Inc.
Chang-Chun Lee - National Tsing Hua University

5. Comprehensive Study of Thermal Impact on Warpage Behaviour of FOWLP with Different Die to Mold Ratio
Siak Boon Lim - Institute of Microelectronics
Wen Wei Seit - Institute of Microelectronics
Tai Chong Chai - Institute of Microelectronics
Debbie Claire Sanchez - ERS electronic GmbH

6. A Novel Chip Placement Technology for Fan-Out WLP using Self-Assembly Technique with Porous Chuck Table
Tadatomo Yamada - LINTEC Corporation
Ken Takano - LINTEC Corportaion
Toshiaki Menjo - LINTEC Corporation
Shinya Takyu - LINTEC Corporation

7. Extreme Large Exposure Field with Fine Resolution Lithography Technology to Enable Next Generation Panel Level Advanced Packaging
Timothy Chang - Onto Innovation
Casey Donaher - Onto Innovation
Amr Hafez - Onto Innovation
Alex Chou - Onto Innovation
Keith Best - Onto Innovation