Technical Program

Program Sessions: Thursday June 1st 2:00 PM — 5:05 PM

Session 24: High-Speed Signal and Power Integrity
Committee: RF, High-Speed Components & Systems
Room: Mediterranean 7 & 8

Session Co-Chairs:

Rockwell Hsu
Cisco Systems, Inc.
Email: [email protected]

Chuei-Tang Wang
Taiwan Semiconductor Manufacturing Company, Ltd.
Email: [email protected]


1. Comprehensive PDN/PSIJ Analysis of DTC (Deep-Trench Capacitors) Use for 8.533 GT/s LPDDR5X Application
Scott Powers — Qualcomm Technologies, Inc.
Jonathan Casanova — Qualcomm Technologies, Inc.
Arun Kundu — Qualcomm Technologies, Inc.
Xiao Ma — Qualcomm Technologies, Inc.
Varin Sriboonlue — Qualcomm Technologies, Inc.
Srivatsan Thiruvengadam — Qualcomm Technologies, Inc.
Jaemin Shin — Qualcomm Technologies, Inc.

2. Design Considerations for Power Delivery Network and Metal Insulator Metal Capacitor Integration in Bridge-Chips for 2.5-D Heterogeneous Integration
Ankit Kaul — Georgia Institute of Technology
Madison Manley — Georgia Institute of Technology
Muhannad S. Bakir — Georgia Institute of Technology

3. Statistical Analysis of Off-Chip Power-Integrity for Multicore Systems
Sodam Han — Samsung Electronics Co., Ltd.-Foundry Business
Sungwook Moon — Samsung Electronics Co., Ltd.-Foundry Business
Jungil Son — Samsung Electronics Co., Ltd.-Foundry Business
Seungki Nam — Samsung Electronics Co., Ltd.-Foundry Business

4. HBM3 Modules on Latest 2.3D High Density Organic Laminate: Signal Integrity Design and Analysis With Interconnect Budget Results
Frank Libsch — IBM Research
Hiroyuki Mori — IBM Research, Tokyo

5. Signal and Power Integrity Design and Analysis for Bunch-of-Wires (BoW) Interface for Chiplet Integration on Advanced Packaging
Ram Krishna — University of Illinois
Atom Watanabe — IBM Corporation
John Golz — IBM Corporation
Ravi Bonam — IBM Corporation
Frank Libsch — IBM Corporation
Elyse Rosenbaum — University of Illinois
Arvind Kumar — IBM Corporation

6. Metaconductor-Based High Signal Integrity Interconnects for 112 Gbps SerDes Interface With Channel Analysis
Hae-In Kim — University of Florida
Alexander Wilcher — University of Florida
Saeyeong Jeon — University of Florida
Brice Achkir — Cisco Systems, Inc.
Rockwell Hsu — Cisco Systems, Inc.
Yong-Kyu Yoon — University of Florida

7. Signal Integrity Co-Design of a High-Speed (20 Gbps) Analog Passive CMOS Bidirectional Switch
Srikanth Manian — Texas Instruments, Inc.
S. Shanmuganarayanan — Texas Instruments, Inc.
Rajen Murugan — Texas Instruments, Inc.
Sylvester Ankamah-Kusi — Texas Instruments, Inc.