Technical Program

Session 35: Emerging Quantum and Advanced Interconnects
Committee: Emerging Technologies

Session Co-Chairs:

Meriem Akin
Volkswagen AG
T +49-561-490-58953
meriem.akin@volkswagen.de
Dongming He
Qualcomm Technologies, Inc.
T +1-858-651-8139
dhe@qti.qualcomm.com

Papers:

1. Nb-Based Superconducting Silicon Interconnect Fabric for Cryogenic Computing Applications
Yu-Tao Yang - University of California, Los Angeles
Chaowei Hu - University of California, Los Angeles
Peng Zhang - University of California, Los Angeles
Niloofar Shakoorzadeh - University of California, Los Angeles
Haoxiang Ren - University of California, Los Angeles
Ni Ni - University of California, Los Angeles
Kang Wang - University of California, Los Angeles
Subramanian Iyer - University of California, Los Angeles

2. Quantum Fibre Optic Interconnect for Quantum Networks
Heng Loong Lee - SENKO Advanced Components (HK)
Richard Pitwon - RESOLUTE PHOTONICS

3. Numerical study of metal ink behavior on the wettability pattern for conductive line inkjet-printing with lattice Boltzmann approach
Jung Shin Lee - Samsugn Electronics
Jung Woo Cho - Samsugn Electronics
Sun Woo Park - Samsugn Electronics
Seungdon Lee - Samsugn Electronics
Hyunjin Lee - Samsugn Electronics
Daniel Min Woo Rhee - Samsugn Electronics

4. Lidded Electronic Package with Boiling Enhancement Features
Jimmy Chuang - Intel Microelectronics
Jin Yang - Intel Corporation
David Shia - Intel Corporation
YL Li - Intel Microelectronics

5. Extreme High Aspect Ratio RDL Patterning with Low Temperature Curable Polyimide using Double Patterning Technology
Atsushi Nakamura - Fujifilm Corporation
Takanori Koizumi - Fujifilm Corporation
Naoki Sato - Fujifilm Corporation
Michihiro Ogawa - Fujifilm Corporation
Daisuke Asakawa - Fujifilm Corporation
Toshihide Aoshima - Fujifilm Corporation
Yuki Sakamoto - Fujifilm Corporation
Hitoshi Noguchi - Fujifilm Corporation

6. Simultaneous Transfer and Bonding (SITRAB) Process for Micro-LEDs Using Laser-Assisted Bonding with Compression (LABC) Process and SITRAB Adhesive
Kwang-Seong Choi - Electronics and Telecommunications Research Institute
Jiho Joo - Electronics and Telecommunications Research Institute
Yong-Sung Eom - Electronics and Telecommunications Research Institute
Gwang-Mun Choi - Electronics and Telecommunications Research Institute
Ki-Seok Jang - Electronics and Telecommunications Research Institute
Chanmi Lee - Electronics and Telecommunications Research Institute
Seok Hwan Moon - Electronics and Telecommunications Research Institute
Ho-Gyeong Yun - Electronics and Telecommunications Research Institute
Ji-Hoon Choi - AQLASER Co., Ltd
Ji-Woong Choi - Electronics and Telecommunications Research Institute

7. Performance Analysis of Self Heated Multilayer Vertical Graphene Nanoribbon Interconnects
Bhawana Kumari - IIT Dhanbad
Rahul Kumar - Indian Institute of Technology Ropar
Manodipan Sahoo - IIT Dhanbad
Rohit Sharma - Indian Institute of Technology Ropar