Technical Program

Program Sessions: Friday June 2nd 2:00 PM – 5:05 PM

Session 35: Packaging and Materials for Flexible Medical Technologies
Committee: Emerging Technologies
Room: Palazzo C

Session Co-Chairs:

Vaidyanathan Chelakara
Acacia Communications
Email: [email protected]

Yang Liu
Nokia Bell Labs
Email: [email protected]


1. Fully Portable Wireless Soft Stethoscope and Machine Learning for Continuous Real-Time Auscultation and Automated Disease Detection
Sung Hoon Lee – Georgia Institute of Technology
Yun-Soung Kim – Georgia Institute of Technology
Woon-Hong Yeo – Georgia Institute of Technology

2. Patch-Type Flex SiP Platform for Healthcare Application
Ming-Hung Chen – ASE Corporate R&D Center
Wei-Hao Chang – ASE Corporate R&D Center
Hui-Ping Jian – ASE Corporate R&D Center
Chao-Wei Liu – ASE Corporate R&D Center
Shang-Lin Wu – ASE Corporate R&D Center
Yi-Chun Chou – ASE Corporate R&D Center
Sung-Hung Chiang – ASE Corporate R&D Center
Jung-Kai Chang – ASE Corporate R&D Center
Tun-Ching Pi – ASE Corporate R&D Center
Wei-Chun Lee – ASE Corporate R&D Center
Jen-Chieh Kao – ASE Corporate R&D Center
Yung-I Yeh – ASE Corporate R&D Center

3. Development of PMUT Array Packaging from Characterisation Prototypes to Customer Samples
Mark Andrew Shaw – STMicroelectronics
Domenico Giusti – STMicroelectronics
Gerald Klug – DISCO HiTec Europe
Hitoshi Hoshino – DISCO HiTec Europe
Fabio Quaglia – STMicroelectronics
Vempati Srinivasa Rao – Institute of Microelectronics A*STAR
Dutta Rahul – Institute of Microelectronics A*STAR
Hideyuki Sandoh – DISCO Corporation
Alessandro Savoia – Roma Tre University
Masatoshi Wakahara – DISCO Corporation
Alex Gritti – STMicroelectronics
David Ho Soon Wee – Institute of Microelectronics A*STAR

4. Multi-Cell Array of Nanogap Electrodes for Labelfree Detection of Biomolecules
Musafargani Sikkandhar – Institute of Microelectronics A*STAR
Yu Chen – Institute of Microelectronics A*STAR
Ming-Yuan Cheng – Institute of Microelectronics A*STAR

5. Electrospray Printing of Polymeric and Metallic Coatings for Electronics Packaging
Emma Pawliczak – Binghamton University
Bryce Kingsley – Binghamton University
Paul Chiarot – Binghamton University

6. 3D Printed Electronics with Multi Jet Fusion for Flexible Hybrid Electronics
Jarrid A. Wittkopf – HP Inc.
Sanil Jhaveri – HP Inc.
Fan Fei – HP Inc.
Manjarik Mrinal – HP Inc.
Eric Luna-Ramirez – HP Inc.
Dylan Richmond – Binghamton University
Dayue Jiang – Binghamton University
Fuda Ning – Binghamton University
Mohamed Alhendi – Binghamton University
Detlef Smilgies – Binghamton University
Mark Poliks – Binghamton University
Lihua Zhao – HP Inc.

7. Performance Evaluation of RF Novel Microstrip Lines Printed on Flexible Substrates
Abdullah Obeidat – Binghamton University
Mohammed Alhendi – Binghamton University
Mohamed Abdelatty – Binghamton University
Ashraf Umar – Binghamton University
Emuobosan Enakerakpo – Binghamton University
Riadh Al-Haidari – Binghamton University
Mark Poliks – Binghamton University