Technical Program

Session 35: AI, Quantum Computing and Novel 3D Packaging solutions
Committee: Emerging Technologies

Session Co-Chairs:

Yang Liu
Nokia Bell Labs
T 914-330-9341
yang3d@gmail.com
Vaidyanathan Chelakara
Acacia Communications
T +1-613-720-2994
cvaidyanathan@acacia-inc.com

Papers:

1. RF Characterization on Nb-Based Superconducting Silicon Interconnect Fabric for Future Large-Scale Quantum Applications
Yu-Tao Yang - UCLA ECE
Chaowei Hu - UCLA Physics & Astronomy
Su Kong Chong - UCLA ECE
Murat Can Sarıhan - UCLA ECE
Haoxiang Ren - UCLA ECE
Ni Ni - UCLA Physics & Astronomy
Chee Wei Wong - UCLA ECE
Kang L. Wang - UCLA ECE
Subramanian Iyer - UCLA ECE

2. Development of Cu-Cu Side-by-Side Interconnection Using Controlled Electroless Cu Plating
Yung-Sheng Lin - ASE Group
Yu-An Chen - National Taiwan University
Po-Shao Shih - National Taiwan University
Fu-Ling Chang - National Taiwan University
Simon Johannes Gräfner - National Taiwan University
Jeng-Hau Huang - National Taiwan University
Ching-Han Huang - National Taiwan University
Yun-Ching Hung - ASE Group
Chin-Li Kao - ASE Group
David Tarng - ASE Group
CR Kao - National Taiwan University

3. Design of Compact Microwave Multiplexer for RF Reflectometry Characterization of Silicon-Based Spin Qubits
Vignesh Shanmugam Bhaskar - ASTAR - Institute of Microelectronics
Mihai Dragos Rotaru - ASTAR - Institute of Microelectronics

4. Small Package Size Low Power CMOS Image Sensor Using Two Different Type Small Through Silicon Vias Technology for 3D Packaging
Hoi-Jin Lee - SAMSUNG
Heeseok Lee - SAMSUNG
Kyunghwan Lee - SAMSUNG

5. Stability Analysis of Nanoscale Copper-Carbon Hybrid Interconnects
Bhawana Kumari - IIT (ISM), Dhanbad
Rohit Sharma - IIT, Ropar
Manodipan Sahoo - IIT (ISM), Dhanbad

6. Functional Testing of AI Cores Through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules
Mukta Farooq - IBM
Arvind Kumar - IBM
Saekyu Lee - IBM
Ravi Bonam - IBM
Juan Gomez - IBM
James Kelly - IBM
Kohji Hosokawa - IBM
Akiyo Nomura - IBM
Yasuteru Kohda - IBM
Timothy Dickson - IBM
Katsuyuki Sakuma - IBM

7. Exploring the Impact of Parametric Variability on Eye Diagram of On-Chip Multi-Walled Carbon Nanotube Interconnects Using Fast Machine Learning Techniques
KM Dimple - Indian Institute of Technology Roorkee
Surila Guglani - Indian Institute of Technology Roorkee
Suyash Kushwaha - Indian Institute of Technology Ropar
Rahul Kumar - Indian Institute of Technology Roorkee
Sourajeet Roy - Indian Institute of Technology Roorkee
Rohit Sharma - Indian Institute of Technology Ropar
Brajesh Kumar Kaushik - Indian Institute of Technology Roorkee