Technical Program

Session 37: Interactive Presentations 1
Committee: Interactive Presentations

Session Co-Chairs:

Mark Eblen
Kyocera International SC
mark.eblen@kyocera.com
Jeffrey Lee
iST-Integrated Service Technology Inc.
jeffrey_lee@istgroup.com
Kyo-Ning Chiang
National Tsinghua University
knchiang@pme.nthu.edu.tw

Papers:

The Effect of Thermal Stress on the Reliability of All-Printed Vias on Flexible Substrates
Kankanige Udara Somarathna - Binghamton University
Mohammed Alhendi - Binghamton University
Behnam Garakani - Binghamton University
Mark D. Poliks - Binghamton University
Darshana Weerawarne - University of Colombo
Joseph Iannotti - General Electric
Christopher J. Kapusta - General Electric
Nancy Stoffel - General Electric
Stephen G. Gonya - Lockheed Martin

Mechanical Property Evolution in SAC+Bi Lead Free Solders Subjected to Various Thermal Exposure Profiles
Mohammad Al Ahsan - Auburn University
S M Kamrul Hasan - Auburn University
Mohammad Ashraful Haq - Auburn University
Jeffrey Suhling - Auburn University
Pradeep Lall - Auburn University

Extreme Low-Temperature High Strain-Rate Constitutive Behavior Evolution of Doped and Undoped Lead Free Solders Under Sustained High Temperature Exposure
Pradeep Lall - Auburn University
Vishal Mehta - Auburn University
Vikas Yadav - Auburn University
Mrinmoy Saha - Auburn University
Jeff Suhling - Auburn University
Dave Locker - US Army CCDC-AC

Effects of β-Sn Crystal Orientation on the Deformation Behavior of SAC305 Solder Joints
Debabrata Mondal - Auburn University
Mohammad Ashraful Haq - Auburn University
Jeffrey Suhling - Auburn University
Pradeep Lall - Auburn University

Reconstructing More Sinterable Surfaces for Copper Nanoparticles to  Form High-Strength Cu-Cu Joints in Air Atmosphere
Yudui Zhang - Shenzhen Institute of Advanced Electronic Materials
Chuncheng Wang - Osaka University
Yue Yao - Osaka University
Tao Zhao - Shenzhen Institute of Advanced Electronic Materials
Pengli Zhu - Shenzhen Institute of Advanced Electronic Materials
Rong Sun - Shenzhen Institute of Advanced Electronic Materials
Liang Xu - Shenzhen Institute of Advanced Electronic Materials

Two/Multi-photon Imaging for Characterization of Fine Line Features and Microvias in Advanced Packaging
Mohanalingam Kathaperumal - Georgia Institute of Technology
Bai Nie - Intel Corporation
Pragna Bhaskar - Georgia Institute of Technology
Christopher Blancher - Georgia Institute of Technology
Pratik Nimbalkar - Georgia Institute of Technology
Fuhan Liu - Georgia Institute of Technology
Madhavan Swaminathan - Georgia Institute of Technology

Development of Advanced Liquid Cooling Solution on Data Centre Cooling
Xiaowu Zhang - Institute of Microelectronics (IME), A*STAR
Yong Han - Institute of Microelectronics (IME), A*STAR
Gongyue Tang - Institute of Microelectronics (IME), A*STAR
Haoran Chen - Institute of Microelectronics (IME), A*STAR
Boon Long Lau - Institute of Microelectronics (IME), A*STAR

The Effects of Bi Doping and Aging on Viscoplasticity of Sn-Ag-Cu-Bi alloys
Vishnu Shukla - University of Central Florida
Nicholas Ayers - University of Central Florida
Andrea Moreno - University of Central Florida
Natalie Crutchfield - University of Central Florida
Devin Lyons - University of Central Florida
Tengfei Jiang - University of Central Florida
Omar Ahmed - Juniper Networks
Peng Su - Juniper Networks
Bernard Glasauer - Juniper Networks

Numerical Simulation of Cu/Polymer-Dielectric Hybrid Bonding Process Using Finite Element Analysis
Sasi Kumar Tippabhotla - Institute of Microlectronics (IME), A*STAR
Lin Ji - Institute of Microlectronics (IME), A*STAR
Yong Han - Institute of Microlectronics (IME), A*STAR

Investigating Moisture Diffusion in Mold Compounds (MCs) for Fan-Out-Wafer-Level-Packaging (FOWLP)
Abdellah Salahouelhadj - Imec
Mario Gonzalez - Imec
Arnita Podpod - Imec
Eric Beyne - Imec

Mechanical and Thermal Characterization Analysis of Chip-Last Fan-Out Chip on Substrate
WeiJie Yin - ASE Group
Wei-Hong Lai - ASE Group
Ying-Xu Lu - ASE Group
KarenYU Chen - ASE Group
Hung-Hsien Huang - ASE Group
Tang-Yuan Chen - ASE Group
Chin-Li Kao - ASE Group
CP Hung - ASE Group

Low Cost Copper Based Sintered Interconnect Material for Optoelectronics Packaging
Sri Krishna Bhogaraju - Institute of Innovative Mobility
Maximilian Schmid - Institute of Innovative Mobility
E Liu - Institute of Innovative Mobility
Rodolfo Saccon - Institute of Innovative Mobility
Gordon Elger - Institute of Innovative Mobility
Holger Klassen - Osram Opto Semiconductors GmbH
Klaus Müller - Institute of Innovative Mobility
Georg Pirzer - Institute of Innovative Mobility

Study of Small Polyimide Open Size in Contact Resistance and Reliability for Flip Chip Cu Pillar Package
Kuei Hsiao Kuo - Siliconware Precision Industries Co., Ltd.
Shaun Xiao - Siliconware Precision Industries Co., Ltd.
Abram Hwang - Siliconware Precision Industries Co., Ltd.
Kui Chang - Siliconware Precision Industries Co., Ltd.
Jovi Chang - Siliconware Precision Industries Co., Ltd.
Feng Lung Chien - Siliconware Precision Industries Co., Ltd.

Package Design Through Reliable Predictive Modeling and Its Validation
Pengcheng Yin - Binghamton University
Seungbae Park - Binghamton University
Biju Jacob - General Electric
Liang Yin - General Electric
Arun Gowda - General Electric

Thermo-Mechanical Reworkable Epoxy Underfill in Board-Level Package: Material Characteristics and Reliability Criteria
Lip Teng Saw - Western Digital
Mutharasu Devarajan - Western Digital

Block Thermal Model for High Power Lidded Packages
Daijiao Wang - Broadcom, Inc.
Sam Karikalan - Broadcom, Inc.

A Parameter Study for the Design Optimization to Relieve Pattern Stress of PCB Under the Temperature Cycling Condition
Hyunggyun Noh - Samsung Electronics Co., Ltd.
Kyungwoo Lee - Samsung Electronics Co., Ltd.
Jinsu Bae - Samsung Electronics Co., Ltd.
Yuchul Hwang - Samsung Electronics Co., Ltd.
Hoosung Kim - Samsung Electronics Co., Ltd.
Sangwoo Pae - Samsung Electronics Co., Ltd.

Characterization and Design Improvement of a High Bandwidth, High Frequency Flexible Connector for Signal Delivery
Randall Irwin - University of California, Los Angeles
Subramanian S. Iyer - University of California, Los Angeles

Investigation of Reflow Effect and Empirical Lifetime Modeling on the Board Level Solder Joint Reliability
Kwangwon Seo - Samsung Electronics Co., Ltd.
Keunho Rhew - Samsung Electronics Co., Ltd.
Choongpyo Jeon - Samsung Electronics Co., Ltd.
Youngsung Choi - Samsung Electronics Co., Ltd.
Jinsoo Bae - Samsung Electronics Co., Ltd.
Hoosung Kim - Samsung Electronics Co., Ltd.
Sangwoo Pae - Samsung Electronics Co., Ltd.

Finite Element Influence Analysis of Power Module Design Options
Marius van Dijk - Fraunhofer IZM
Olaf Wittler - Fraunhofer IZM
Ping-Chi Hung - Universal Scientific Industrial Co., Ltd.
Willy H. Lai - ASE Group
C. Y. Hsieh - ASE Group
Thomas Wang - ASE Group
Martin Schneider-Ramelow - Technical University Berlin

Solder Joint Fatigue Studies Subjected to Board-Level Random Vibration for Automotive Applications
Valeriy Khaldarov - ASONIKA, LLC
Andy Zhang - Texas Instruments
Dongji Xie - Nvidia Corporation
Jeffrey Lee - iST-Integrated Service Technology
Xue Shi - Bosch Automotive Products
Romuald Roucou - NXP Semiconductors
Sushil Doranga - Lamar University
Alexander Shalumov - ASONIKA, LLC

2-D Fluid Simulation Approach for Miniwave Soldering
Reinhardt Seidel - FAPS, FAU Erlangen-Nürnberg
Marcel Sippel - FAPS, FAU Erlangen-Nürnberg
Jörg Franke - FAPS, FAU Erlangen-Nürnberg

Component Level Reliability Evaluation of Low Cost 6-Sided Die Protection Versus Wafer Level Chip Scale Packaging with 350 μm Ball Pitch
Jacinta Aman Lim - nepes Corporation
Byung-Cheol Kim - nepes Corporation
Rizi Valencia-Gacho - nepes Corporation
Brett Dunlap - nepes Corporation

Simulation of the Filler Stuck Mechanism in Molding Process and Verification
Tzu Chieh Chien - ASE Group
Shih Kun Lo - ASE Group
Yen Hua Kuo - ASE Group
Hui Chung Liu - ASE Group
Zong Yuan Li - ASE Group
Yi Nong Lin - ASE Group
Lu Ming Lai - ASE Group
Kuang Hsiung Chen - ASE Group

Inlet/Outlet Induced Failures During Flip-Chip Bonding of Large Area Chip with Embedded Microchannels
Jianyu Du - China University of Geosciences
Yuchi Yang - Institute of Microelectronics (IME), A*STAR
Huaiqiang Yu - Electronics Technology Group Corporation
Han Xu - Institute of Microelectronics (IME), A*STAR
Deyin Zheng - Institute of Microelectronics (IME), A*STAR
Qi Wang - Institute of Microelectronics (IME), A*STAR
Jiajie Kang - China University of Geosciences
Wei Wang - Institute of Microelectronics (IME), A*STAR