Technical Program

Session 39: High Speed Channel Design, Power Delivery and Analysis
Committee: Interactive Presentations

Session Co-Chairs:

Kristina Young-Fisher
T +1-518-530-3718
Michael Mayer
University of Waterloo
T +1-519-888-4024


1. Impact of System-in-Package in Side-by-Side discrete SoC-DRAM Configurations on SI, PI and Thermal Performance
Goeun Kim - Samsung Electronics Company, Ltd.
Doohee Lim - Samsung Electronics Company, Ltd.
Jongmin Lee - Samsung Electronics Company, Ltd.
Insik Chang - Samsung Electronics Company, Ltd.
Jun So Pak - Samsung Electronics Company, Ltd.
Youngsang Cho - Samsung Electronics Company, Ltd.
Yunhyeok Im - Samsung Electronics Company, Ltd.

2. 5G Antenna in Module (AiM) Architecture to Realize a Large Active Antenna Array with Unequal Shortest Microstrip Paths to Minimize Feeding Loss by Using True-delay Line based Phase Shifters at Millimeter Wave Frequencies
Zhao-He Lin - National Taiwan University
Hsi-Tseng Chou - National Taiwan University
Pin-Zhong Shen - National Taiwan University of Science and Technology
Ding-Bing Lin - National Taiwan University of Science and Technology
Chao-Shun Yang - Powertech Technology Inc.
Chieh-Wei Chou - Powertech Technology Inc.
Chi-Liang Pan - Powertech Technology Inc.
Chun-Te Lin - Powertech Technology Inc.
Ji-Cheng Lin - Powertech Technology Inc.
Li-Chih Fang - Powertech Technology Inc.

3. Millimeter-Wave Circuits Using 3D Printed Suspended Line Technology for Automotive Applications
Amanpreet Kaur - Oakland university
Yamini Kotriwar - Michigan State University
Yihang Chu - Michigan State University
Mohammad Pervez - Oakland University
Saranraj Karuppuswami - Altair
Prem Chahal - Michigan State University

4. Optimizing On-Die Power Delivery Network to Maximize Benefit Given by Package-Level Power Delivery Network
Jisoo Hwang - Samsung Electronics Company, Ltd.

5. Feature Selective Validation (FSV) Application to S-Parameter Models Directly
Zhaoqing Chen - IBM Corporation

6. Impact of DBI feature on Peak Distortion Analysis of LPDDR5 at 6400Mbps
Ashish Gupta - Intel Corporation
Anant Chopra - Intel Corporation

7. Chip/Package Co-Design Analysis of Advanced D2D Interface Using a Statistical Link Simulator
Sangwook Park - Samsung Electronics Company, Ltd.
Heewoo An - Samsung Electronics Company, Ltd.
Seonghwan Jeon - Samsung Electronics Company, Ltd.
Gyoungbum Kim - Samsung Electronics Company, Ltd.
Dan (Kyung Suk) Oh - Samsung Electronics Company, Ltd.

8. AiP Component and Board Level Heat Dissipation Analysis for Automotive Radar
Yong Han - Institute of Microelectronics, A*STAR
Tai Chong Chai - Institute of Microelectronics, A*STAR
Sharon Seow Huang Lim - Institute of Microelectronics, A*STAR

9. The Impact of Ageing on the Dielectric Properties of Laminates for Automotive Radar
Julia-Marie Koeszegi - Technische Universit├Ąt Berlin
Marco Rossi - Fraunhofer IZM
Oliver Schwanitz - Fraunhofer IZM
Hans Walter - Fraunhofer IZM
Ivan Ndip - Fraunhofer IZM
Klaus-Dieter Lang - Fraunhofer IZM
Martin Schneider-Ramelow - Fraunhofer IZM

10. Terahertz Imaging Array Using a Chip First Additive Manufacturing Process
Yihang Chu - Michigan State University
Premjeet Chahal - Michigan State University