Technical Program

Wednesday, June 01, 2022

Session 4: Hybrid Bonding and Innovations for 3D Integration
8:00 AM - 11:40 AM
Committee: Interconnections
Room: Coral 1&2

Session Co-Chairs:

Katsuyuki Sakuma
IBM Corporation
ksakuma@us.ibm.com
Seung Yeop Kook
GLOBALFOUNDRIES
seung-yeop.kook@globalfoundries.com

Papers:

1. 3-Layer Stacking Technology with Pixel-Wise Interconnections for Image Sensors Using Hybrid Bonding of Silicon-on-Insulator Wafers Mediated by Thin Si Layers
Masahide Goto - NHK Science & Technology Research Laboratories
Yuki Honda - NHK Science & Technology Research Laboratories
Masakazu Nanba - NHK Science & Technology Research Laboratories
Yoshinori Iguchi - NHK Science & Technology Research Laboratories
Takuya Saraya - NHK Science & Technology Research Laboratories
Masaharu Kobayashi - NHK Science & Technology Research Laboratories
Eiji Higurashi - NHK Science & Technology Research Laboratories
Hiroshi Toshiyoshi - NHK Science & Technology Research Laboratories
Toshiro Hiramoto - NHK Science & Technology Research Laboratories

2. Wafer to Wafer Hybrid Bonding for DRAM Applications
Jinwon Park - SK Hynix
Byungho Lee - SK Hynix
Heesun Lee - SK Hynix
Dail Lim - SK Hynix
Jiho Kang - SK Hynix
Changhyun Cho - SK Hynix
Myunghee Na - SK Hynix

3. Analysis of Die Edge Bond Pads in Hybrid Bonded Multi-die Stacks
Jeremy Theil - Xperi Corporation
Thomas Workman - Xperi Corporation
Dominik Suwito - Xperi Corporation
Laura Mirkarimi - Xperi Corporation
Gill Fountain - Xperi Corporation
KM Bang - Xperi Corporation
Guilian Gao - Xperi Corporation
Bongsub Lee - Xperi Corporation
Pawel Mrozek - Xperi Corporation
Cyprian Uzoh - Xperi Corporation
Michael Huynh - Xperi Corporation

4. The Integration of Grounding Plane into TSV Integrated Ion Trap for Efficient Thermal Management in Large Scale Quantum Computing Device
Peng Zhao - Nanyang Technological University
Hong Yu Li - Institute of Microelectronics (IME), A*STAR
Yu Dian Lim - Nanyang Technological University
Wen Wei Seit - Institute of Microelectronics (IME), A*STAR
Luca Guidoni - Universite de Paris
Chuan Seng Tan - Nanyang Technological University

5. Wafer Stacked Wide I/O DRAM with One-Step TSV Technology
Masaya Kawano - Institute of Microelectronics (IME), A*STAR
Xiang-Yu Wang - Institute of Microelectronics (IME), A*STAR
Qin Ren - Institute of Microelectronics (IME), A*STAR
Woon-Leng Loh - Institute of Microelectronics (IME), A*STAR
B.S.S. Chandra Rao - Institute of Microelectronics (IME), A*STAR
King-Jien Chui - Institute of Microelectronics (IME), A*STAR
Tsuyoshi Kawagoe - UltraMemory, Inc.
Ichiro Homma - UltraMemory, Inc.

6. Recess Effect Study and Process Optimization of Sub-10 μm Pitch Die-to-wafer Hybrid Bonding
Haoxiang Ren - University of California, Los Angeles
Yu-Tao Yang - University of California, Los Angeles
Subramanian S. Iyer - University of California, Los Angeles

7. A Performance Testing Method of Bernoulli Picker for Ultra-Thin Die Handling Application
Juno Kim - Samsung Electronics Co., Ltd.
Dae Ho Min - Samsung Electronics Co., Ltd.
Kangsan Lee - Samsung Electronics Co., Ltd.
Kyeongbin Lim - Samsung Electronics Co., Ltd.
Minwoo Daniel Rhee - Samsung Electronics Co., Ltd.