Technical Program

Session 4: Heterogeneous Integration Using 2.xD/3D Packaging Technologies
Committee: Packaging Technologies

Session Co-Chairs:

John Knickerbocker
IBM Corporation
T +1-914-945-3306
knickerj@us.ibm.com
Subhash L. Shinde
Notre Dame University
T +1-574-631-1425
sshinde@nd.edu

Papers: