Technical Program

Session 7: 3D TSV and Interposer
Committee: Interconnections

Session Co-Chairs:

Lei Shan
Tekollect
T
shanlei@yahoo.com
Peter Ramm
Fraunhofer EMFT
T +49-89-54759-539
peter.ramm@emft.fraunhofer.de

Papers:

1. Heterogenous Integration of Silicon Ion Trap and Glass Interposer for Scalable Quantum Computing Enabled by TSV, Micro-bumps, and RDL
Peng Zhao - 1IME,Singapore. 2NTU, Singapore
Hong Yu Li - Institute of Microelectronics, Singapore
Jing Tao - Nanyang Technological University, Singapore
Yu Dian Lim - Nanyang Technological University, Singapore
Wen Wei Seit - Institute of Microelectronics, Singapore
Luca Guidoni - Laboratoire Matériaux et Phénomènes Quantiques
Chuan Seng Tan - Nanyang Technological University, Singapore

2. Pre-bond Qualification of Through-Silicon Via for the Application of 3-D Chip Stacking
Luke Hu - United Microelectronics Corporation
Chun-Hung Chen - United Microelectronics Corporation
M. J. Lin - United Microelectronics Corporation
C. F. Lin - United Microelectronics Corporation
C. T. Yeh - United Microelectronics Corporation
C. H. Kuo - United Microelectronics Corporation
Tony Lin - United Microelectronics Corporation
Steven Hsu - United Microelectronics Corporation

3. 3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55um-75um Mixed Pitch Interconnections on High Density Laminate
Katsuyuki Sakuma - IBM Corporation
Mukta Farooq - IBM Corporation
Paul Andry - IBM Corporation
Cyril Cabral - IBM Corporation
Sankeerth Rajalingam - IBM Corporation
Dale McHerron - IBM Corporation
Shidong Li - IBM Corporation
Russell Kastberg - IBM Corporation
Tom Wassick - IBM Corporation

4. I/O Architecture, Substrate Design, and Bonding Process for a Heterogeneous Dielet-Assembly based Waferscale Processor
Saptadeep Pal - University of California, Los Angeles
Krutikesh Sahoo - University of California, Los Angeles
Irina Alam - University of California, Los Angeles
Haris Suhail - University of California, Los Angeles
Rakesh Kumar - University of Illinois at Urbana Champaign
Sudhakar Pamarti - University of California, Los Angeles
Puneet Gupta - University of California, Los Angeles
Subramanian S. Iyer - University of California, Los Angeles

5. Monitoring of the Effect of Thermal Shock on Crack Growth in Copper Through-Glass Via Substrates
Chukwudi Okoro - Corning Incorporated
Shrisudersan Jayaraman - Corning Incorporated
Scott Pollard - Corning Incorporated

6. Cost Effective 2.3D Packaging Solution by Using Fanout Panel Level RDL
Joonsung Kim - Samsung Electronics Company, Ltd.
Jae-Hoon Choi - Samsung Electronics Company, Ltd.
San-Uk Kim - Samsung Electronics Company, Ltd.
Jooyoung Choi - Samsung Electronics Company, Ltd.
Yongjin Park - Samsung Electronics Company, Ltd.
Gyoungbum Kim - Samsung Electronics Company, Ltd.
Sang Kyu Kim - Samsung Electronics Company, Ltd.
Sangwook Park - Samsung Electronics Company, Ltd.
Hwasub Oh - Samsung Electronics Company, Ltd.
Seok-Won Lee - Samsung Electronics Company, Ltd.
Tae-Je Cho - Samsung Electronics Company, Ltd.

7. A TSV-Last Approach for 3D-IC Integration and Packaging using WNi Platable Barrier Layer
Murugesan Mariappan - Tohoku University
K. Mori - T-Micro
M. Koyanangi - Tohoku University
T. Fukushima - Tohoku University