Technical Program

Session 8: Hybrid Bonding and Innovations for 3D Integration
Committee: Interconnections

Session Co-Chairs:

Katsuyuki Sakuma
IBM Corporation
T +1-914-945-2080
ksakuma@us.ibm.com
Seung Yeop Kook
GLOBALFOUNDRIES
T (+1)-518-319-7452
seung-yeop.kook@globalfoundries.com

Papers:

1. 3-Layer Stacking Technology with Pixel-Wise Interconnections for Image Sensors Using Hybrid Bonding of Silicon-on-Insulator Wafers Mediated by Thin Si Layers
Masahide Goto - Japan
Yuki Honda - Japan
Masakazu Nanba - Japan
Yoshinori Iguchi - Japan
Takuya Saraya - Japan
Masaharu Kobayashi - Japan
Eiji Higurashi - Japan
Hiroshi Toshiyoshi - Japan
Toshiro Hiramoto - Japan

2. Wafer to Wafer Hybrid Bonding for DRAM Applications
Jinwon Park - SKHynix
Byungho Lee - SKHynix
Heesun Lee - SKHynix
Dail Lim - SKHynix
Jiho Kang - SKHynix
Changhyun Cho - SKHynix
Myunghee Na - SKHynix

3. Analysis of Die Edge Bond Pads in Hybrid Bonded Multi-Die Stacks
Jeremy Theil - Xperi Corporation
Thomas Workman - Xperi Corporation
Dominik Suwito - Xperi Corporation
Laura Mirkarimi - Xperi Corporation
Gill Fountain - Xperi Corporation
KM Bang - Xperi Corporation
Guilian Gao - Xperi Corporation
Bongsub Lee - Xperi Corporation
Pawel Mrozek - Xperi Corporation
Cyprian Uzoh - Xperi Corporation

4. Insertion of Grounding Plane into TSV Integrated Ion Trap for Efficient Thermal Management in Large Scale Quantum Computing Device
Peng Zhao - IME and NTU, Singapore
Hong Yu Li - Institute of Microelectronics
Yu Dian Lim - Nanyang Technological University
Wen Wei Seit - Institute of Microelectronics
Luca Guidoni - Universite de Paris
Chuan Seng Tan - Nanyang Technological University

5. Wafer Stacked Wide I/O DRAM with One-Step TSV Technology
Masaya Kawano - Institute of Microelectronics, A*STAR
Xiang-Yu Wang - Institute of Microelectronics, A*STAR
Qin Ren - Institute of Microelectronics, A*STAR
Woon-Leng Loh - Institute of Microelectronics, A*STAR
B.S.S. Chandra Rao - Institute of Microelectronics, A*STAR
King-Jien Chui - Institute of Microelectronics, A*STAR
Tsuyoshi Kawagoe - UltraMemory Inc
Ichiro Homma - UltraMemory Inc

6. Sub-10 μm Pitch Die-to-Wafer (D2W) Hybrid Bonding Investigation for Heterogeneous Integration
Haoxiang Ren - UCLA ECE
Yu-Tao Yang - UCLA ECE
Subramanian Iyer - UCLA, ECE

7. A Performance Testing Method of Bernoulli Picker for Ultra-Thin Die Handling Application
Juno Kim - Samsung Electronics
Dae Ho Min - Samsung Electronics
Kangsan Lee - Samsung Electronics
Kyeongbin Lim - Samsung Electronics
Minwoo Daniel Rhee - Samsung Electronics