74th ECTC Highlights

Note: We will provide links to the presentations as they become available.

Best Paper 74th ECTC will be announced at next ECTC

Best Papers

1)      Best Session Paper
  Advanced Thermocompression Bonding on High Density Fan-Out Embedded Bridge Technology for HPC/AI/ML Applications
  Co-authored by Wiwy Wudjud, Advanced Semiconductor Engineering, Inc., Austin, USA; ShuYu Lin, Yungshun Chang, Jean Yen, Reno Liao, LeoHS Cheng, Yihsien Wu, Simon YL Huang, Jui Tzu Chen, ChengYu Lee, JoeyCl Huang; all with Advanced Semiconductor Engineering, Inc., Kaohsiung, Taiwan; Lihong Cao, Advanced Semiconductor Engineering, Inc., Austin, USA

2)      Best Interactive Presentation Paper 
  A Novel Plasma Etching Technology of RIE-Lag Free TSV and Dicing Processes for 3D Chiplets Interconnect
  Co-authored by Taichi Suzuki, Kenta Doi, Toshiyuki Nakamura, Yasuhiro Morikawa; all from ULVAC, Inc., Susono, Japan

3)      Outstanding Session Paper
  3-Layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator with High-Density TSV for Advanced CMOS Image Sensor Applications
  Co-authored by Stéphane Nicolas, Jerzy-Javier Suarez-Berru, Nicolas Bresson, Carole Socquet-Clerc, Myriam Assous, Stéphan Borel, Rémi Vélard, Jérôme Dechamp, Renan Bouis, Antonio Roman, Karine Abadie, Damien Hebras; all with CEA, LETI, Univ. Grenoble Alpes, Grenoble, France

4)      Outstanding Interactive Presentation Paper 
  Optimization of Core Material Properties for Large Flip-chip Ball Grid Array Substrate to Manage Both Warpage and Board Level Reliability
  Co-authored by Hirokazu Noma, Masaki Takahashi, Nene Hatakeyama, Yuichi Yanaka, Akito Fukui, Keita Johno, Hitoshi Onozeki; all from Resonac Corporation, Japan

5)      Intel Best Student Paper
  In Situ Analysis of Copper Microstructures in Electromigration Using SEM-EBSD Techniques
  Co-authored by Yaqian Zhang, Yixin Yan, Sten Vollebregt, Guoqi Zhang; all from Department of Microelectronics, Delft University of Technology, Delft, The Netherlands

6)      Intel Outstanding Student Paper Award
  Performance Evaluation of UCIe-based Die-to-Die Interface on Low-Cost 2D Packaging Technology
  Co-authored by Srujan Penta, Georgia Institute of Technology, Atlanta, GA, USA; and Marvell Technology, Inc., Burlington, VT, USA; Ting Zheng, Marvell Technology, Inc., Santa Clara, CA, USA; Eric Tremble, Marvell Technology, Inc., Burlington, VT, USA; Aatreya Chakravarti, Marvell Technology, Inc., Burlington, VT, USA; Anthony Sigler, Marvell Technology, Inc., Burlington, VT, USA; Zhonghao Zhang, Georgia Institute of Technology, Atlanta, GA, USA; Carl Benes, Marvell Technology, Inc., Burlington, VT, USA; Muhannad S Bakir, Georgia Institute of Technology, Atlanta, GA, USA; Wolfgang Sauter, Marvell Technology, Inc., Burlington, VT, USA

7)      TI Best IP Student Award
  Deep Reinforcement Learning-Based Power Distribution Network Design Optimization for Multi-Chiplet System
  Co-authored by Weiyang Miao, Zhen Xie, Chuan Seng Tan; all from School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore; Mihai D. Rotaru, Institute of Microelectronics Agency for Science, Technology and Research (A*STAR), Singapore

Special Events Presentations

1)     2024 ECTC Special Session on Industry-Government Co-Investments
Tuesday, May 28, 2024, 8:30 a.m. – 10:00 a.m. (MDT)
Topic: “Exploring the Impact of Industry-Government Co-Investments for the Advanced Electronics Sector in North America, Asia and Europe”
Chairs: Przemyslaw Gromala, Robert Bosch GmbH, and Erik Jung, Fraunhofer IZM
Speakers: Elisabeth Steimetz, EPoSS, Europe, Rao Tummala, Advisor to the Government of India, Eric Lin, CHIPS R&D, USA, David Lynch, CMC Microsystems, Canada, and Kwang-Seong Choi, Electronics and Telecommunications Research Institute, Korea.

2)      2024 ECTC Special Session on Metrology
Tuesday, May 28, 2024, 10:30 a.m. – 12:00 p.m. (MDT)
Topic: “Challenges and Opportunities in Advancing Metrology for Next-Generation Microelectronics”
Chairs: Ran Tao (NIST) and Benson Chan (Binghamton University); Moderator: Jan Vardaman (TechSearch International)
Speakers: Paul Hale, NIST, Gaurang Choksi, Intel Corporation, Zhihua Zou, TSMC, CP Hung, ASE, and Chet Lenox, KLA Corporation

3)      2024 ECTC Special Session on Thermal Management for AI
Tuesday, May 28, 2024, 1:30 p.m. – 3:00 p.m. (MDT)
Topic: “Efficient and Innovative Thermal Management for Power Hungry AI/ML Applications: Challenges and Opportunities”
Chairs: Zhi Yang, Groq, and Sevket Yuruker, Tesla
Speakers: Ki Wook Jung, Samsung, Igor Arsovski, Groq, Mudasir Ahmad, Google, Tiwei Wei, Purdue University, and Christopher Ortiz, Ansys

4)      2024 ECTC Special Session on RF Packaging for above 100 GHz
Tuesday, May 28, 2024, 3:30 p.m. – 5:00 p.m. (MDT)
Topic: “RF Packaging for Communication and Sensing Applications above 100 GHz – Technologies, Design Challenges and Emerging Solutions”
Chairs: Maciej Wojnowski, Infineon Technologies AG, and Ivan Ndip, Fraunhofer IZM/Brandenburg University of Technology
Speakers: Swaminathan Sankaran, Texas Instruments, Martin Letz, Schott AG, Madhavan Swaminathan, Penn State University, and Uwe Maass, Fraunhofer IZM

5)      2024 ECTC Young Professionals Networking Event
Tuesday, May 28, 2024, 7:00 p.m. – 7:45 p.m. (MDT)
Chairs: Aakrati Jain, IBM, Rui Chen Eastern Michigan University, and Zhangming Zhou, Auburn University

6)       2024 IEEE EPS Seminar on Substrates for Chiplets
Tuesday, May 28, 2024, 7:45 p.m. – 9:15 p.m. (MDT)
Topic: “Substrate-Scaling Challenges in Chiplet Integration”
Chairs: Takashi Hisada, Rapidus Corporation, Yasumitsu Orii, Rapidus Corporation, and co-moderated by Rich Graff, Marvell Inc.
Speakers: Gang Duan, Intel, Kinya Ichikawa, TSMC, Kenneth Larsen, Synopsys, Masahisa Ose, Resonac, Harish Penmenthsa, AMAT, Yu-Po Wang, SPIL, and Rozalia Beica, LQDX

7)      ECTC Keynote: Petascale Photonic Chip Connectivity for Energy Efficient AI Computing
Wednesday, May 29, 2024, 8:00 a.m. – 9:15 a.m. (MDT)
Chairs: Karlheinz Bock, TU Dresden
Speakers: Prof. Keren Bergman, the Charles Batchelor Professor of Electrical Engineering at Columbia University in the City of New York

8)      ECTC/iTherm Diversity and Career Growth Panel and Reception
Wednesday, May 29, 2024, 6:30 p.m. – 7:30 p.m. (MDT)
Topic: “Effective Practices to Attract, Promote and Retain a Diverse Workforce”
Chairs: Cristina Amon, University of Toronto, for iTherm, and Vidya Jarayam, Intel, for ECTC
Speakers: Ramona Prioleau, CHIPS, Allyson Stewart, Marvell Inc., Al Ortega, Villanova University, Tina Herrera, NREL, and Ravi Mahajan, Intel

9)      2024 ECTC Plenary Session on Future of Semiconductor Industry
Thursday, May 30, 2024, 8:00 a.m. – 9:15 a.m. (MDT)
Topic: “Emerging Start-ups and Material Innovations in Advanced Packaging”
Chairs: Rozalia Beica, LQDX, and Farhang Yazdani, BroadPak, and the Chair of Jury Panel, Jeffrey Perkins, Yole Group
Speakers: Victor Chiriac, Global Cooling Technology Group,  Wayne Rickard, Terecircuits, and Luc Beauvillier, Thintronics

10)      2024 IEEE EPS President’s Panel Session on Workforce
Friday, May 31, 2024, 8:00 a.m. – 9:15 a.m. (MDT)
Topic: “Challenges in Education and Workforce Development in the New Chips Economy”
Chairs: Patrick Thompson, Texas Instruments, Mark Poliks, Binghamton University, Jeff Suhling, Auburn University, and Kitty Pearsall, Boss Precision Inc.
Speakers: John Oakley, Semiconductor Research Corporation, Toni Mattila, Business Finland, Robert Geer, SUNY Polytechnic University, Wenhui Zhu, Central South University (pre-recorded), and Jim Wieser, Texas Instruments

HIR Presentations

HIR Special Sessions at ECTC 2024 - IEEE Electronics Packaging Society

Media Coverage

IEEE Spectrum: Hybrid Bonding Plays Starring Role in 3D Chips
Article explains the growing importance of hybrid bonding, and details papers presented by various organizations at ECTC on the topic.

IEEE Spectrum: How India Is Starting a Chip Industry From Scratch
An interview with the ECTC govt./industry panelist Rao Tummala on India’s semiconductor ecosystem. 

Laser Focus World: Co-packaging photonics and electronics poses challenges
Interview with ECTC 2024 keynote speaker Dr. Keren Bergman of Columbia University.

EE Times: Rapid AI and HPC Requires Collaboration and Co-optimization
Post-conference article that gives a comprehensive overview of the conference, focusing on the keynote talk, papers on hybrid bonding and high-density substrates, and the startup competition in the Plenary session

PCB Directory: Record Attendance at the 2024 IEEE Electronic Components Technology Conference in Denver
A report on ECTC 2024’s record attendance, submissions/presentations and exhibits, with highlights of major program elements.

3D InCites: ECTC 2024: Advanced Packaging Engineers to the Rescue!
Post-conference article with detailed descriptions of many of the events and panels that occurred at ECTC ‘24.

3D InCites podcasts, conducted onsite at ECTC 2024:

Circuits Assembly/Printed Circuit Design & Fabrication: Hybrid Bonding and Thermal Concerns Heat Up Denver Discussions
A comprehensive report on conference highlights.

Semiconductor Digest: 2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies
News article previewing the conference program.

SemiWiki: Podcast EP224: An Overview of the Upcoming 2024 Electronic Components and Technology Conference with Dr. Michael Mayer
Podcast in which ECTC ’24 program chair Dr. Michael Mayer previews the upcoming ECTC conference, with a focus on hybrid bonding, the professional development courses, and the networking and job-hunting activities that take place behind the scenes.

Chip Scale Review: ECTC 2024: New, Larger Venue
Two-page preview of ECTC 2024 by Dr. Michael Mayer, ECTC ’24 program chair (p. 50).

EE Times Japan: Development results of semiconductor packaging and soldering technologies gathered at ECTC
A comprehensive post-conference report by Akira Fukuda, who attended.

EE Times Japan: The semiconductor industry will face a serious shortage of engineers in 10 years' time
Coverage of the workforce panel session by Akira Fukuda, who attended.

EE Times Japan: Three new materials startups introduced at ECTC plenary session
Coverage of the startup competition plenary session by Akira Fukuda, who attended.

Silicon Semiconductor China: Professor Wang Wei's team at Peking University has made progress in chip thermal management
This article calls ECTC “the top international conference in the field of electronic component packaging.”

Electronics Weekly: Semiconductor skills shortages highlighted at ECTC
Coverage of the panel session on workforce challenges.

PC Watch: AMD and Intel's cutting-edge "3.5D" packaging technology
A detailed report on papers given by AMD and Intel on new “3.5D” packaging technology.

TimesTech: Exploring Workforce Challenges in Microelectronics: 2024 ECTC Highlights
Coverage of the panel session on workforce challenges.

Sisa Journal-e: Samsung Electronics Improves Exynos Heat Dissipation with 3D Packaging Technology
Detailed report on Samsung paper #9.2, titled 'High-Performance 3D Packaging Technology for Mobile AP.'

Les Actualites: 3D chip technology to save Moore's law
Lengthy report describing ECTC papers on hybrid bonding.

Circuits Assembly: Panel at 2024 IEEE Electronic Components and Technology Conference
A news story on the panel session on government/industry co-investment programs.

Photonics Spectra: Photonic Tech Lights Up IEEE Electronic Components and Technology Conference
News article previewing the conference, with emphasis on photonics content.

eeNews Analog: Technical conference supports chiplet paradigm
Conference preview profiling papers by IBM and Samsung.