66th ECTC Highlights
Best Papers
1) Best Session Paper
High-Frequency Analysis of Embedded Microfluidic Cooling Within 3-D ICs Using a TSV Testbed”
Authors: Hanju Oh, Xucheng Zhang, Gary S. May, and Muhannad S. Bakir – Georgia Institute of Technology
2) Best Interactive Presentation Paper
"Constitutive Relations for Finite Element Modeling of SnAgCu in Thermal Cycling – How Wrong We Were!" - Peter Borgesen, Thaer Alghoul, Farhan Batieha, Nardeeka Adams, Saif Khasawneh, Dustin Watson, and Chris Greene – Binghamton University
3) Outstanding Session Paper
“Eternal Packages: Liquid Metal Flip Chip Devices” - Authors: Assane Ndieguene, Pierre Albert, and Julien Sylvestre – Université de Sherbrooke; Clément Fortin and Valérie Oberson – IBM Corporation
4) Outstanding Interactive Presentation Paper
"20” x 20” Panel Size Glass IPD Interposer Manufacturing" - YuHu Chen, ChunHsien Chien, YuChung Hsieh, WeiTi Lin, WenLiang Yeh, ChienChou Chen, and TzvyJang Tseng – Unimicron Technology Corp.; Hobie Yune – Qualcomm Technologies, Inc.
5) Intel Best Student Paper
"Non-Linear Finite Element Analysis on Stacked Die Package Subjected to Integrated Vapor-Hygro-Thermal-Mechanical Stress" - J. Wang and S. Park - Binghamton University
6) Texas Instruments Outstanding Student Interactive Presentation Paper Award
"2D Grating Pitch Mapping of a Through Silicon Via (TSV) and Solder Ball Interconnect Region Using Laser Diffraction" - T. Houghton, M. Saxon, Z. Song, H. Nguyen, H. Jiang, and H. Yu - Arizona State University
Event Presentations
1) 2016 Luncheon Keynote- Dare Mighty Things: Landing a Car on Mars
Presenter: Jordan P. Evans, Manager of the Mechanical Systems Division, Jet Propulsion Laboratory
2) Memory Technology Advances and Prospects for Packaging
(Chair: Nanju Na – Xilinx, Inc.)
Bryan Black – Advanced Micro Devices, Inc. Road to the AMD FIJI GPU
Sandeep Bharathi – Xilinx, Inc. High Performance Memories in FPGAs
Nick Kim – SK Hynix, Inc Prospect for the Memory Packaging Technology
Craig Hampel – Rambus, Inc. Architecture or Package Design--Which comes first?
Ravi Mahajan – Intel Corporation Memory Demand Trends & What they mean to Packaging Technology
3) 2016 Optoelectronics Special Session: Emerging Optical Interconnect Packaging for the Cloud
(Chairs: Kannan Raj – Oracle and Fuad Doany – IBM Corporation)
Frank Flens – Finisar Corporation
Peter De Dobbeleare – Luxtera, Inc.
Wilfried Haensch – IBM Corporation
Ashok Krishnamoorthy – Oracle
Erin Byrne – TE Connectivity, Ltd.
4) 2016 ECTC Panel Session:Power Module Integration
(Chairs: Yoshikazu Takahashi – Fuji Electric Co. Ltd. and Patrick McCluskey –University of Maryland,College Park)
Klaus-Dieter Lang, Fraunhofer IZM
Bernd Roemer - Infineon Technologies AG
Hiroshi Hozoji, Hitachi, Ltd.
Yoshiyuki Nagatomo, Mitsubishi MaterialsCorporation
Jared Hornberger, Wolfspeed
Avi Bar-Cohen - University of Maryland,College Park
5) 2016 CPMT Women’s Panel:Maximize Your Career Potential
(Chair: Beth Keser – Qualcomm Technologies, Inc.)
Maryam Rofougaran – Seasoned Entrepreneur, Fmr. SVP of Engineering
Jan Vardaman – President, TechSearch International, Inc.
Rebeca Jimenez – Sr. Vice President, Amkor Technology, Inc.
6) 2016 ECTC Plenary Session: Life after Moore’s Law
(Chair: Rozalia Beica – Dow Electronic Materials)
Subramanian Iyer – University of California, Los Angeles CHIPS
Luc Van den hove – IMEC
Dim Lee Kwong – IME, Singapore Life after Moore's Law @ A*STAR
Liqiang Cao – NCAP, China NCAP China
Marie-Noelle Semeria – CEA-LETI
7) 2016 CPMT Seminar: Systems, Devices, and Packaging Technologies for the IoT and Hyper-Connected Society
(Chairs: Venkatesh Sundaram – Georgia Institute of Technology & Yasumitsu Orii– IBM Corporation)
Mudasir Ahmad – Cisco Systems, Inc.
Kohji Hosokawa – IBM Corporation
Christian Hoffmann – TDK-Epcos
Eita Horiki – Sekisui America Corporation
Media Coverage
1) 3D InCites
ECTC 2016: Is the Life after Moore’s Law?
Words of Advice From Successful Women in Advanced Packaging
ECTC 2016: Memory Technology Advances and Prospects for Packaging
2) Solid State Technology
ECTC 2016 the 66th ECTC
Die Stacking Options for 2.5D
Advances in FO-WLP at 2016 IEEE ECTC
ECTC 2016: IMEC Discusses Economics of TSV Implementation Options
Sarda Voltage Regulators; ECTC 2016 – Copper Pumping; Copper Pillar on Embedded Trace
New Fab Construction? Look to China; Rumors from ECTC: InFO — ASE — DECA
Samsung EM enters FO-WLP Packaging Mkt; Mold Cmpd Free FO-WLP for Sub MM ICs
FTLE 299 Siliconware’s Ma Discusses Die Stacking Options for 2.5D
3) Yole Development
Micro transfer printing: a closer look
