Packaging Technologies
Major Topics: 2.XD/3D architectures/designs for energy efficient HPC / C2C links / structures / thermal solutions / methods & processes; heterogeneous (chiplet) integration for 2.5D / 3D-IC for AI / Neural Nets / HBM / CPU / GPU / ASIC /CPO; silicon, glass, diamond & organic interposer & advanced package technology; DD Cu / Cu TSV / hybrid bonding / backside power; embedded die / bridge / passives, flexible, advanced substrates & modules; fan-out wafer and panel level packaging, advanced flip-chip, SiP, CSP, PoP; RF, wireless, MEMS, Sensors & loT, automotive, wireless power and power electronics; SiC, GaN, PMIC, SPS; bio, medical, flexible, wearable & extreme environments packaging.
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Chair
Mike Gallagher DuPont Electronic Materials 455 Forest Street Marlborough MA 01752 USA Phone: +1-508229-7681 Email: Click Here |
Assistant Chair
Peng Su Juniper Networks Building B 1137 Innovation Way Sunnyvale CA 94089 USA Phone: +1-408-936-5855 Email: Click Here |
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Jie Fu
Apple Inc. 95014 1 Apple Park Way Cupertino CA 95014 United States Phone: +1-424-672-5772 Email: Click Here |
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Kuldip Johal
MKS Instruments- MSD 1750 Overview Drive Rock Hill South Carolina 29732 USA Phone: +18033700669 Email: Click Here |
Sam Karikalan
Broadcom Inc. 15191 Alton Pkwy Irvine CA 92618 USA Phone: 1-949-926-7296 Email: Click Here |
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Young-Gon Kim
Renesas Electronics America 6024 Silver Creek Valley Road San Jose CA 95138 USA Phone: +1-408-761-5830 Email: Click Here |
John Knickerbocker
IBM Corporation 06-032 1101 Kitchawan Road Yorktown Heights NY 10598 USA Phone: +1-914-945-3306 Email: Click Here |
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Steffen Kroehnert
ESPAT Consulting, Germany Nesselgrundweg 2 Dresden Saxony 01109 Germany Phone: +49 351 2758 1287 Email: Click Here |
Albert Lan
Applied Materials No 32, R&D Road II HsinChu Science Park HsinChu City 30076 Taiwan Phone: +886-3-5793588 Email: Click Here |
John H. Lau
Unimicron Technology Corporation No. 179, Shanying Road, Guishan Industrial Park Taoyuan City 33341 Taiwan Phone: 886-3350-0386 ext:11118 Email: Click Here |
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Kyu-Oh Lee
Intel Corporation 5000 W Chandler Blvd Chandler AZ 85226 USA Phone: +1 480-554-7740 Email: Click Here |
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Luu Nguyen
Psi Quantum 700 Hansen Way Palo Alto CA 94306 USA Phone: +1-408-551-9117 Email: Click Here |
Raj Pendse
Facebook FRL (Facebook Reality Labs) 1350 Willow Road Menlo Park CA 94025 USA Phone: +1-(510)709-8076 Email: Click Here |
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Subhash L. Shinde
Notre Dame University Center for Sustainable Energy 115 Stinson-Remick Hall Notre Dame Indiana 46556 USA Phone: +1-574-631-1425 Email: Click Here |
Joseph W. Soucy
Draper Laboratory 555 Technology Square Cambridge MA 02139-3563 USA Phone: +1-617-258-2953 Email: Click Here |
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Kuo-Chung Yee
Taiwan Semiconductor Manufacturing Corporation, Inc. 168,Park Ave. 2, Hsinchu Science Park Hsinchu County 308-44 Taiwan R.O.C. Phone: +886-3-5636688 Ext. 7222920/7223012 Email: Click Here |
