Thermal/Mechanical Simulation & Characterization
Major topics: thermal/mechanical simulation and characterization at component, board, and system levels for all packaging technologies: reliability related modeling including fracture mechanics, fatigue, electromigration, warpage, delamination, moisture, drop, shock and vibration, and modeling for harsh environments (thermal, chemical, etc.); material constitutive relations; chip-package interaction for heterogeneous integration, wafer fabrication and package assembly process related modeling; novel modeling techniques including multi-scale physics, co-design approaches; quantum computing; measurement methodologies, characterization and correlations, model order reduction, sensitivity analysis, optimization, statistical analysis; application of artificial intelligence on modeling, characterization, digital twin; and credible simulations for virtual release.
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Chair
Wei Wang Qualcomm Technologies, Inc. 5775 Morehouse Drive San Diego CA 92121 USA Phone: +1-858-651-5933 Email: Click Here |
Assistant Chair
Karsten Meier Technische Universität Dresden Institute of Electronic Packaging Technology Mommsenstrasse 15 Dresden Saxony 01069 Germany Phone: +49 351 463 - 36 594 Email: Click Here |
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Rui Chen
Georgia Institute of Technology George W. Woodruff School of Mechanical Engineering 813 Ferst Drive NW Atlanta GA 30332 USA Phone: +1-470-232-5868 Email: Click Here |
Kuo-Ning Chiang
National Tsinghua University No. 101, Sec. 2, KungFu Rd. HsinChu 300 Taiwan Phone: +886-3-574-2925 Email: Click Here |
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Xuejun Fan
Lamar University Department of Mechanical Engineering PO Box 10028 Beaumont TX 77710 USA Phone: +1-409-880-7792 Email: Click Here |
Przemyslaw Gromala
Robert Bosch GmbH Automotive Elecronics Tuebinger Str. 123 Reutlingen 72762 Germany Phone: +49-162-8514983 Email: Click Here |
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Pradeep Lall
Auburn University Dept. of Mechanical Engineering 201 Ross Hall Auburn AL 36830 USA Phone: +1-334-844-3424 Email: Click Here |
Chang-Chun Lee
National Tsing hua University (NTHU) No. 101, Sec. 2, KungFu Rd. HsinChu 300 Taiwan Phone: +886-3-5162410 Email: Click Here |
Sheng Liu
Wuhan University School of Power and Mechanical Engineering No. 8, South Donghu Road, Wuchang District Wuhan Hubei Province China Phone: +86-27-68774381 Email: Click Here |
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Yong Liu
ON Semiconductor MS 35-2E 82 Running Hill Road South Portland ME 04106 USA Phone: +1-207-761-3155 Email: Click Here |
Erdogan Madenci
University of Arizona Dept. of Aerospace and Mechanical Engineering Tucson AZ 85721 USA Phone: +1-520-621-6113 Email: Click Here |
Tony Mak
Wentworth Institute of Technology Applied Mathematics and Engineering 550 Huntington Ave. Boston MA 02115 USA Phone: +1-334-625-8669 Email: Click Here |
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Patrick McCluskey
University of Maryland Dept. of Mechanical Engineering 2125 Glenn L. Martin Hall #88 College Park MD 20742 USA Phone: +1-301-405-279 Email: Click Here |
Jiamin Ni
IBM 1101 Kitchawan Rd Yorktown Heights NY 10598 USA Phone: +1-518-596-3407 Email: Click Here |
Erkan Oterkus
University of Strathclyde Glasgow G4 0LZ United Kingdom Phone: +44 (0)141 548 3876 Email: Click Here |
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Suresh K. Sitaraman
Georgia Institute of Technology George W. Woodruff School of Mechanical Engineering 813 Ferst Dr., NW Atlanta GA 30332 USA Phone: +1-404-894-3405 Email: Click Here |
Ning Ye
Western Digital 951 SanDisk Dr. Milpitas CA 95035 USA Phone: +1-408-801-1278 Email: Click Here |
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G. Q. (Kouchi) Zhang
Delft University of Technology (TUD) Delft Institute for Micro/Nanoelectronics and System Feldmannweg 17 Delft 2600 BG Netherlands Phone: +31-6-24888240 Email: Click Here |
Tieyu Zheng
Microsoft Corporation One Microsoft Way Redmond WA 98052 USA Phone: +1-425- 722-1141 Email: Click Here |
Jiantao Zheng
Hisilicon Section D, Bantian Longgang Base Shenzhen China Phone: +86-755-28425738 Email: Click Here |
