Thermal/Mechanical Simulation & Characterization

Major Topics: Component, Board and System Level Modeling for Microelectronics, e.g., 3D Interconnects (TSV, Stacked Die, etc.), 2.5D Packaging (Si, Glass, Flexible Interposer, etc.), flexible substrates/systems, Wafer-Level-Package (WLP), Ball- Grid-Array (BGA), Fan-Out Packages, Embedded Packages with Active and Passive Components, System-in-Package (SiP), Chiplet Systems/Packages, Panel Level Packaging (PLP), Power Electronic Modules, LED Packaging, RF materials (substrates, EMC, solder mask) & RF/5G systems, and MEMS; Reliability modeling related fracture mechanics, fatigue, Electromigration, warpage, delamination, moisture, drop test, material constitutive relations and characterization; Chip-Package Interaction, Wafer Fabrication Process Related Modeling; Novel modeling techniques including Multi-Scale Physics, and Co-Design Approaches, and Wide Range Strain Rate Solutions; Measurement methodologies, characterization and correlations, model order reduction, sensitivity analysis, optimization, probability, machine learning and digital twin; Fab/thin wafer handling, wire bonding and assembly manufacture process.

Chair
Ning Ye
Western Digital

951 SanDisk Dr.
Milpitas CA 95035
USA
Phone: +1-408-801-1278
Email: Click Here
Assistant Chair
Wei Wang
Qualcomm Technologies, Inc.

5775 Morehouse Drive
San Diego CA 92121
USA
Phone: +1-858-651-5933
Email: Click Here
Christopher J. Bailey
University of Greenwich
Old Royal Naval College
Park Row
London SE10 9LS
United Kingdom
Phone: +44 (0) 20 8331 8660
Email: Click Here
Kuo-Ning Chiang
National Tsinghua University

No. 101, Sec. 2, KungFu Rd.
HsinChu 300
Taiwan
Phone: +886-3-574-2925
Email: Click Here
Xuejun Fan
Lamar University
Department of Mechanical Engineering
PO Box 10028
Beaumont TX 77710
USA
Phone: +1-409-880-7792
Email: Click Here
Przemyslaw Gromala
Robert Bosch GmbH
Automotive Elecronics
Tuebinger Str. 123
Reutlingen 72762
Germany
Phone: +49-162-8514983
Email: Click Here
Nancy Iwamoto
Honeywell Performance Materials and Technologies
Advanced Materials
P.O. Box 547
Ramona CA 92065
USA
Phone: +1-760-831-9511
Email: Click Here
Pradeep Lall
Auburn University
Dept. of Mechanical Engineering
201 Ross Hall
Auburn AL 36830
USA
Phone: +1-334-844-3424
Email: Click Here
Chang-Chun Lee
National Tsing hua University (NTHU)

No. 101, Sec. 2, KungFu Rd.
HsinChu 300
Taiwan
Phone: +886-3-5162410
Email: Click Here
Sheng Liu
Wuhan University
School of Power and Mechanical Engineering
No. 8, South Donghu Road, Wuchang District
Wuhan Hubei Province
China
Phone: +86-27-68774381
Email: Click Here
Yong Liu
ON Semiconductor
MS 35-2E
82 Running Hill Road
South Portland ME 04106
USA
Phone: +1-207-761-3155
Email: Click Here
Erdogan Madenci
University of Arizona
Dept. of Aerospace and Mechanical Engineering

Tucson AZ 85721
USA
Phone: +1-520-621-6113
Email: Click Here
Tony Mak
Wentworth Institute of Technology
Applied Mathematics and Engineering
550 Huntington Ave.
Boston MA 02115
USA
Phone: +1-334-625-8669
Email: Click Here
Karsten Meier
Technische Universit├Ąt Dresden
Institute of Electronic Packaging Technology
Mommsenstrasse 15
Dresden Saxony 01069
Germany
Phone: +49 351 463 - 36 594
Email: Click Here
Erkan Oterkus
University of Strathclyde


Glasgow G4 0LZ
United Kingdom
Phone: +44 (0)141 548 3876
Email: Click Here
Suresh K. Sitaraman
Georgia Institute of Technology
George W. Woodruff School of Mechanical Engineering
813 Ferst Dr., NW
Atlanta GA 30332
USA
Phone: +1-404-894-3405
Email: Click Here
G. Q. (Kouchi) Zhang
Delft University of Technology (TUD)
Delft Institute for Micro/Nanoelectronics and System
Feldmannweg 17
Delft 2600 BG
Netherlands
Phone: +31-6-24888240
Email: Click Here
Tieyu Zheng
Microsoft Corporation

One Microsoft Way
Redmond WA 98052
USA
Phone: +1-425- 722-1141
Email: Click Here
Jiantao Zheng
Hisilicon
Section D, Bantian Longgang Base

Shenzhen
China
Phone: +86-755-28425738
Email: Click Here