Photonics
Major topics: Photonic Components Packaging for computing, communications, data processing, mobility, healthcare, green energy photonics, agriculture, horticulture, food, environmental, climate and atmosphere monitoring, space, automobile, underwater, industrial, defense, process integration, co-packaging (Photonics - Electronics - Laser Integration), free space optics, microscopy and advanced spectroscopy, 3D printing of micro-optical components for packaging, assembly and manufacturing; Packaging for the quantum photonics world; Packaging of new photonics materials; Optical characterization of packaging components; Equipment and tools for photonics packaging; detachable fiber array unit; ultra-low power photonics and materials; heterogeneous materials; Quantum Dot; meta surfaces and metamaterials.
