Emerging Technologies
Major topics: Packaging for quantum computing and other cryogenic applications; metrology for advanced packaging and emerging technologies; AI in electronics packaging and its applications; challenges in hardware security; AI electronics packaging and its applications; power electronics and energy storage; MEMS & NEMS; emerging, novel and unique flexible/stretchable/wearable hybrid electronics, medical devices and bioelectronics; additive, hybrid, nano-, and smart manufacturing for electronics packaging; green and sustainable electronics, net zero strategy/technology; Digital Twin.
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Chair
Tengfei Jiang University of Central Florida 4000 Central Florida Blvd Orlando FL 32816 USA Phone: 1-407-823-2284 Email: Click Here |
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Isaac Robin Abothu
Siemens Healthineers Ultrasound Division 22010 SE 51st Street Issaquah WA 98029 USA Phone: +1-425-557-1288 Email: Click Here |
Karlheinz Bock
Technische Universitat Dresden Institut für Aufbau- und Verbindungstechnik der Elektronik Mommsenstrasse 15 Dresden 01062 Germany Phone: +49-351-46336345 Email: Click Here |
Benson Chan
Binghamton University IEEC, Center of Excellence Building Office 1109 85 Murray Hill Rd Vestal NY 13850 USA Phone: +1-607-777-4349 Email: Click Here |
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Vaidyanathan Chelakara
Cisco 50 Allanford Ave. Ottawa None K1T 3Z6 Canada Phone: +1-613-720-2994 Email: Click Here |
Rabindra N. Das
MIT Lincoln Labs Advanced Technology Division 244 Wood St. Lexington MA 02420 USA Phone: +1-781-981-1318 Email: Click Here |
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Dongming He
Qualcomm Technologies, Inc. 5775 Morehouse Drive San Diego CA 92121 USA Phone: +1-858-651-8139 Email: Click Here |
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Jong-Hoon Kim
Washington State University Vancouver School of Engineering and Computer Science 14204 NE Salmon Creek Avenue Vancouver WA 98686-9600 USA Phone: +1-360 546-9250 Email: Click Here |
Santosh Kudtarkar
Analog Devices 804 Woburn Street Wilmington MA 01887 USA Phone: +1-781-9372462 Email: Click Here |
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Kevin J. Lee
Qorvo Corporation 2300 NE Brookwood Parkway Hillsboro OR 97124 USA Phone: +1-503-615-9151 Email: Click Here |
Zhuo Li
Fudan University Materials Science Building 1, Room 504 220 Handan Road Shanghai 200433 China Phone: +86-21-65643267 Email: Click Here |
Yang Liu
Nokia Bell Labs 600 Mountain Ave New Providence NJ 07974 USA Phone: 914-330-9341 Email: Click Here |
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Chukwudi Okoro
Corning Mechanics and Reliability Sciences Dept. 1 Science Center Drive Corning NY 14831 USA Phone: +1-607-248-0717 Email: Click Here |
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Jintang Shang
Southeast University Key Lab of MEMS of Education Ministry,Southeast University, Sipailou 2, Nanjing, P.R. China Sipailou 2 Nanjing 210096 P.R. China Phone: +86 13913869603 Email: Click Here |
W. Hong Yeo
Georgia Institute of Technology Pettit Microelectronics Research Center 791 Atlantic Dr NW #204 Atlanta GA 30332 United States Phone: 404-385-5710 Email: Click Here |
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Hongqing Zhang
IBM Corporation 2070 Route 52 Hopewell Jct NY 12533 USA Phone: 484-896-8709 Email: Click Here |
