Electrical Design & Analysis (formerly RF, High-Speed Components & Systems)
Major topics: 5G/6G, IoT, cloud computing, autonomous vehicles, AI/machine learning; antennas, sensors, power transfer, wired/wireless communications, RF to THz; multiphysics/multiscale modeling & characterization of interconnects, modules, components, and systems; chiplet, heterogeneous Integration, chip-to-chip, die-to-die, SiP/MCM/system co-design (chip/pkg/board), UCIe, HBM/HPC; opto-Electrical (OE) hybrid integration, analog packaging, power electronics modeling/characterization; high-speed/frequency (RF, mmWave, THz) signal integrity, power integrity, and EMI/EMC; 5G/6G, IoT, cloud computing, autonomous vehicles, AI/machine learning.
