Interconnections
Major Topics: Interconnection Technology and Processing- Hybrid/direct Cu bonding, fan-out, panel-level, chiplets, SiP, flip-chip, 2.5D/3D, Si/glass/organic interposers, TSV, micro-bump, Cu pillar, wirebonding thermo-compression bonding, fine-pitch/multi-layer RDL, printable interconnects, flexible substrates, photonic interconnects, quantum interconnects; Interconnection Material, Characterization and Reliability- Conductive/non-conductive adhesives, low temperature solder, underfill, molding compounds, thermal interface materials, thermal/mechanical/electrical tests and reliability; Interconnection physical co-design and architectures for emerging applications- HPC, mobile, 5G, IoT, power and rugged electronics, medical and health, automotive, aerospace, flexible hybrid electronics, micro-LED display.
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Chair
Thom Gregorich Infinera Optical Modules Group 895 Pepper Pl Milpitas CA 95035 USA Phone: +1 208-297-0138 Email: Click Here |
Assistant Chair
Zhang Chaoqi Qualcomm Inc 5775 Morehouse Drive San Diego CA 92121 Phone: (+1)8588456604 Email: Click Here |
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Jian Cai
Tsinghua University Institute of Microelectronics, Tsinghua University Qinghua Yuan, Haidian Beijing China Phone: +86-13501114301 Email: Click Here |
C. Key Chung
TongFu Microelectronics Co. Ltd. Chongchuan Road, No. 288 Nantong Jiangsu 42756 China Phone: +86-15365568052 Email: Click Here |
David Danovitch
University of Sherbrooke 45, Blvd de l’Aeroport Bromont QC J2L 1S8 Canada Phone: +1-450-534-8000 X-1400 Email: Click Here |
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Bernd Ebersberger
Infineon Technologies BE OSAT Am Campeon 10-15 Neubiberg 85579 Germany Phone: +49-89-234-38175 Email: Click Here |
Takafumi Fukushima
Tohoku University 6-6-12 Aza-Aoba, Aramaki, Aoba-Ku, Sendai 980-8579 Japan Phone: +81-22-795-6978 Email: Click Here |
Seung Yeop Kook
GLOBALFOUNDRIES 400 Stonebreak Road Ext. Malta NY 12020 Phone: (+1)-518-319-7452 Email: Click Here |
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Li Li
Infinera SJC-D/2/4 170 West Tasman Drive San Jose CA 95134 USA Phone: +1-408-527-0801 Email: Click Here |
Ou Li
Advanced Semiconductor Engineering, Inc. 26 Chin 3rd Road Kaohsiung None 811 Taiwan Phone: +886 7-361-7131 Email: Click Here |
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Changqing Liu
Loughborough University Wolfson School of Mechanical & Manufacturing Engineering Leicestershire Loughborough LE11 3TU United Kingdom Phone: +44-1509-227681 Email: Click Here |
Wei-Chung Lo
ITRI, Industrial Technology Research Institute BLDG11-Rm354, 195, Sec. 4, ChungHsing Rd. Chutung, HsinChu 31040 Taiwan, ROC Phone: +886-3-591-7024 Email: Click Here |
Nathan Lower
Consultant MS 108-101 1415 Doe Run Dr North Liberty IA 52317 USA Phone: +1-319-331-2817 Email: Click Here |
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James Lu
Rensselaer Polytechnic Institute CII-6015/CIE 110 8th Street Troy NY 12180 USA Phone: +1-518-276-2909 Email: Click Here |
Peter Ramm
Fraunhofer EMFT Research Institution for Microsystems and Solid State Technologies Hansastr. 27d Munich 80686 Germany Phone: +49-89-54759-539 Email: Click Here |
Katsuyuki Sakuma
IBM Research 1101 Kitchawan Rd, Route 134 Yorktown Heights NY 10598 USA Phone: +1-914-945-2080 Email: Click Here |
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Jean-Charles Souriau
CEA Leti Minatec Campus 17 rue des Martyrs Grenoble Cedex 9 38054 France Phone: +33 4 38 78 98 13 Email: Click Here |
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Chuan Seng Tan
Nanyang Technological University S2-B2c-85 50 Nanyang Avenue Singapore Singapore 639798 Singapore Phone: +65-67905636 Email: Click Here |
Chih-Hang Tung
Taiwan Semiconductor Manufacturing Company 8 Li-Hsin Rd 6 Hsinchu Science Park Hsinchu 300-78 Taiwan Phone: (+886)-3-5636688 Email: Click Here |
Xin Yan
Intel Corporation 5000 W. Chandler Blvd. Chandler AZ 85226 Phone: +1-217-299-7363 Email: Click Here |
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Matthew Yao
GE Aerospace 111 River Park Dr. Dayton OH 45409 USA Phone: +1-412-897-4008 Email: Click Here |
Dingyou Zhang
Broadcom Inc. 1320 Ridder Park Drive San Jose CA 95131 United States Phone: Email: Click Here |
