Interconnections
Major Topics: Interconnects for chiplets, heterogeneous integration, hybrid bonding, C2W, W2W, fan-out, panel-level, TSV, TGV; interconnects for 2.5D/3D, Si/glass/organic interposers, fine-pitch/multi-layer RDL, SiP, wafer- level system integration; interconnects for thermo-compression/laser assisted/transient liquid phase bonding, low temperature solder, flip-chip, micro-bump, Cu pillar, wirebond, Al ribbon bond; printable interconnects, flexible interconnect, quantum interconnects, optical interconnects, Interconnects for SiC/GaN or WBG; interconnection materials, chemistries, metrology, characterization and reliability; conductive/non-conductive adhesives, ACF, underfill, molding compounds; chiplet interconnect design and validation, UCIe/BoW/etc. standards; thermal interface materials, thermal/mechanical/electrical tests and reliability.
